Patents Assigned to Nikko Materials USA, Inc.
  • Patent number: 6860481
    Abstract: A sheet stacking device for stacking sheets of generally rigid material, comprised of at least one gripper device operable to releasably grip an edge of a sheet material and gripper drive means operable to move the gripper device from a first location to a second location. A support device supports the sheet as the sheet moves from the first location to the second location. The support device has a supporting position, wherein the support device supports the sheet and a non-supporting position wherein support for the sheet is removed. A stacking platform is provided below the second location. Control means control the gripper device, the gripper drive means and the support device.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: March 1, 2005
    Assignee: Nikko Materials USA, Inc.
    Inventors: Maurice Chiasson, Stephen Copley, Albert Burgun
  • Patent number: 6841084
    Abstract: A resistive etching solution containing thiourea, which is particularly suitable for etching an electrically resistive material comprised of a nickel-chromium alloy. The resistive etching solution allows for fast and effective etching of a nickel-chromium alloy in cases where the ratio of (a) copper surface area to (b) nickel/chromium surface area, is relatively large, and where fine feature etching is desired.
    Type: Grant
    Filed: February 11, 2002
    Date of Patent: January 11, 2005
    Assignee: Nikko Materials USA, Inc.
    Inventors: Dan Lillie, Jiangtao Wang
  • Patent number: 6805964
    Abstract: In one embodiment, the present invention relates to a composite article, comprising a metal foil having a first side and a second side; a protective film of at least one inert silane, titanate or zirconate overlying the first side of the metal foil; and a metal sheet having a first side and a second side, the first side overlying the protective film. In another embodiment, the present invention relates to a method of increasing tarnish resistance of metal foil comprising contacting the metal foil with an inert silane, titanate or zirconate compound to form a protective film having a thickness from about 0.001 microns to about 1 micron on a surface of the metal foil; and attaching the foil to a metal sheet.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: October 19, 2004
    Assignee: Nikko Materials USA, Inc.
    Inventors: Sidney J. Clouser, Michael A. Centanni
  • Patent number: 6771160
    Abstract: A resistor foil, comprised of a copper layer having a first side and a second side. An intermediate layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 50 Å and 2 &mgr;m is disposed on the intermediate layer, and a second layer of a second resistor metal having a thickness of between 50 Å and 2 &mgr;m is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: August 3, 2004
    Assignee: Nikko Materials USA, Inc.
    Inventors: Jiangtao Wang, Michael A. Centanni, Sidney J. Clouser
  • Patent number: 6770976
    Abstract: A method and apparatus for forming a relatively thin releasable layer of copper on a carrier substrate. First, a separation facilitating layer is provided on the carrier substrate. A layer of vapor-deposited copper is then formed over the separation facilitating layer to protect the separation facilitating layer during subsequent processing. Thereafter, the thickness of the copper layer is increased by the electrodeposition of copper onto the vapor-deposited layer. The copper layer is applied to a dielectric and is released from the carrier substrate at the separation facilitating layer.
    Type: Grant
    Filed: February 13, 2002
    Date of Patent: August 3, 2004
    Assignee: Nikko Materials USA, Inc.
    Inventors: Jiangtao Wang, Dan Lillie, David B. Russell, Sidney J. Clouser
  • Patent number: 6770380
    Abstract: A laminate for use in production of printed circuit boards comprising a metal layer having a first side and a second side; a metallic substrate, one side of the metallic substrate being attached to the first side of the metal foil; an adhesive substrate formed of a polymeric material having a first surface and a second surface, the first surface being attached to the second side of the copper foil, the adhesive substrate being at least partially uncured; and a releasable protective film along the second surface of the adhesive substrate.
    Type: Grant
    Filed: August 11, 1998
    Date of Patent: August 3, 2004
    Assignee: Nikko Materials USA, Inc.
    Inventors: R. Richard Steiner, Shiuh-Kao Chiang
  • Patent number: 6691874
    Abstract: A sheet stacking device, comprised of a sheet support bed having a plurality of side-by-side rollers that are freely rotatable about an associated roller axis. A drive assembly moves the sheet support bed in a predetermined direction along a closed path. The path has a horizontal upper run and a horizontal lower run, and is dimensioned such that a space exists between the first end and the second end of the sheet support bed as the sheet support bed moves along the path.
    Type: Grant
    Filed: November 5, 2001
    Date of Patent: February 17, 2004
    Assignee: Nikko Materials USA, Inc.
    Inventor: Hermann Wursthorn
  • Patent number: 6673471
    Abstract: A component for use in manufacturing articles such as printed circuit boards, the component comprising: a sheet of copper foil which, in a finished printed circuit board, constitutes a functional element; a substrate sheet of aluminum which constitutes a discardable element, and a protective coating layer on a surface of said substrate, one surface of the copper sheet and the coating layer on said substrate aluminum sheet being essentially uncontaminated and engageable with each other at an interface, and the uncontaminated surfaces of the sheets being manufactured together to define a substantially uncontaminated central zone inwardly of the edges of the sheets and unjoined at the interface.
    Type: Grant
    Filed: February 23, 2001
    Date of Patent: January 6, 2004
    Assignee: Nikko Materials USA, Inc.
    Inventor: R. Richard Steiner
  • Patent number: 6531039
    Abstract: An anode for use in electroplating semiconductor wafers, comprising a metal plate formed from a generally continuous casting process that is essentially free of voids or cracks, the casting being thermo-mechanically worked until the anode has an average grain size of less than 100 &mgr;m.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: March 11, 2003
    Assignee: Nikko Materials USA, Inc.
    Inventor: Stephen J. Kohut
  • Patent number: RE39615
    Abstract: The invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH2, NHR1, (NHC(?NH))mNH2, R2COOH, NR12, C(O)NHR1, R2NR12, R2OH, R2SH, R2NH2 and R2NHR1, wherein R1 is a hydrocarbon group, R2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R1, OR1 or SO2C6H4—NH2; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: May 8, 2007
    Assignee: Nikko Materials USA, Inc.
    Inventor: Charles A. Poutasse