Abstract: A method for moving a stage relative to a base includes coupling a magnet assembly to the stage; coupling an array of coils to the base; and directing current to at least one of the coils with a control system that includes a processor to generate a force that levitates the stage relative to the base and moves the stage relative to the base. In one embodiment, the control system generates at least one current command that levitates and moves the stage while inhibiting the excitation of a first targeted flexible mode.

Abstract: A method for moving a stage includes coupling a stage mover to the stage, and directing current to the stage mover with a control system. The stage mover includes a magnet array and a conductor array positioned adjacent to the magnet array. The conductor array includes a first layer of coils and a second layer of coils, with the first layer of coils being closer to the magnet array than the second layer of coils. The control system directs current to the first layer of coils and the second layer of coils independently. Further, the control system directs more current to the first layer of coils than the second layer of coils during a movement step to reduce the power consumption.

Abstract: Lithographic exposure tool and method for operating thereof are provided that includes modification of the tool (assessed based on the measurements of geometrical distortions caused, in the tool, by the exposure process and used to train the exposure tool) to ensure that such geometrical distortions are reduced for any chosen exposure process. The method includes processing first data (representing distortions caused by initial exposure run(s)) to estimate second data (representing distortions that would occur for another exposure run); and forming a modified exposure tool by changing at least one of a) a geometrical path or a path along which the workpiece stage is repositioned during the operation of the exposure tool; b) one or more of a presence, position, orientation, size and shape of an optical component of an optical projection sub-system of the optical system of the exposure tool; and c) a parameter of scanning synchronization of the exposure tool.

Abstract: A linear motor for use in semiconductor processing apparatuses. The linear motor is a three axis linear motor that includes magnets that cover end turns of coil windings in order to utilize the end turns to generate a force along a second or third axis. The coil windings are positioned between two magnet arrays and each magnet array has a magnet, such as a voice coil motor (VCM) magnet, positioned along one side to cover the endturns and provide a magnetic flux. A VCM back iron is positioned to provide a magnetic flux return path for the VCM magnets. The structure in conjunction with a DC offset produces a useful force.

Abstract: An actuator assembly (16) for moving a device (22) includes a stator component (30), a mover component (32), a measurement system (18), and a signal processor (20). The measurement system (18) includes (i) a magnet assembly (244) that is coupled to and moves with the mover component (32); and (ii) a plurality of spaced apart sensors (246A). The magnet assembly (244) produces a magnetic field (244B) that moves relative to the stator component (30) as the mover component (32) moves along a mover axis (32C). Each sensor (246A) is a transducer that generates a sensor signal that varies its output voltage in response to the changing magnetic field (244B) from the magnet assembly (244) as the mover component (32) is moved relative to the sensors (246A). The signal processor (20) receives the sensor signals and estimates a position of the mover component (32) along the mover axis (32C) based at least in part on the sensor signals.

Abstract: Lithographic exposure tool and method for operating thereof that includes modification of the tool (assessed based on the measurements of geometrical distortions caused, in the tool, by the exposure process and used to train the exposure tool) to ensure that such geometrical distortions are reduced for any chosen exposure process. The method includes processing first data (representing distortions caused by initial exposure run(s)) to estimate second data representing distortions that would occur for another exposure run); and forming a modified exposure tool by changing at least one of a) a geometrical path is a path along which the workpiece stage is repositioned during the operation of the exposure tool; b) one or more of a presence, position, orientation, size and shape of an optical component of an optical projection sub-system of the optical system of the exposure tool; and c) a parameter of scanning synchronization of the exposure tool.

Abstract: Non-linear metallic thermal resist structure having more than two layers of different metals and effective eutectic temperature that is lower than eutectic temperature of a reference non-linear metallic thermal resist having only two layer of same different metals. Optionally, at least one the layers of such resist structure is doped with material different from host metals and/or deposited under conditions resulting in strain or stress in a layer at hand. Method of multi-exposure-based patterning of a substrate carrying such structure with laser pulses characterized by irradiance at levels equal to or below 10 mJ/cm2. The sequence of steps producing the required pattern on the substrate may be explicitly lacking a step of removal of a portion of the resist structure between two consecutive exposures.

Abstract: A mirror assembly (32) for directing a beam (28) includes a base (450), and an optical element (454) that includes (i) a mirror (460), (ii) a stage (462) that retains the mirror (460), (iii) a mover assembly (464) that moves the stage (462) and the mirror (460) relative to the base (450), and (v) a thermally conductive medium (466) that is positioned between the stage (462) and the base (450) to transfer heat between the stage (462) and the base (450). The thermally conductive medium (466) has a thermal conductivity that is greater than the thermal conductivity of air. The thermally conductive medium (466) can include an ionic fluid or a liquid metal.

Abstract: An optical system configured as part of optical metrology unit used to assess the operational status of a workpiece and, in a specific case, configured as an encoder head of a lithographic exposure tool. The optical system is devoid of a stand-alone optical corner-cubes and includes, instead, a single, imperfect or frustrated cuboid of optically-isotropic material that, in operation with the diffraction grating of the workpiece, simultaneously forms four interferometric signals for measuring x-, y, and z-positions of the workpiece grating relative to the optical system. Proposed system and method solve problems of (i) structural complexity of a conventional metrology unit for use in an exposure tool, (ii) burdensome alignment of the multitude of optical prisms in the process of forming such metrology unit, and (iii) cyclic non-linear errors associated with measurements involving conventional corner-cubes-based metrology units.

Abstract: Lithographic exposure tool and method for operating thereof that includes modification of the tool (assessed based on the measurements of geometrical distortions caused, in the tool, by the exposure process and used to train the exposure tool) to ensure that such geometrical distortions are reduced for any chosen exposure process. The method includes processing first data (representing distortions caused by initial exposure run(s)) to estimate second data representing distortions that would occur for another exposure run); and forming a modified exposure tool by changing at least one of a) a geometrical path is a path along which the workpiece stage is repositioned during the operation of the exposure tool; b) one or more of a presence, position, orientation, size and shape of an optical component of an optical projection sub-system of the optical system of the exposure tool; and c) a parameter of scanning synchronization of the exposure tool.

Abstract: A method for moving a stage includes coupling a stage mover to the stage, and directing current to the stage mover with a control system. The stage mover includes a magnet array and a conductor array positioned adjacent to the magnet array. The conductor array includes a first layer of coils and a second layer of coils, with the first layer of coils being closer to the magnet array than the second layer of coils. The control system directs current to the first layer of coils and the second layer of coils independently. Further, the control system directs more current to the first layer of coils than the second layer of coils during a movement step to reduce the power consumption.

Abstract: A chamber assembly (26) for providing a sealed chamber (40) adjacent to a workpiece (28) to counteract the influence of gravity on the workpiece (28) includes a chamber housing (244), and a seal assembly (33) that expands and/or contracts to better seal against the workpiece (28). Further, the chamber assembly (26) can include one or more transducer assemblies (34) that expand or contract to quickly respond to leaks or injections of fluid in chamber assembly (26) to maintain a constant and stable chamber pressure in the chamber assembly (26). Moreover, the chamber assembly (26) can utilize a pressure source (35) that directs a lager amount of fluid (374) through a fluid passageway (368) to accurately maintain the pressure within the chamber assembly (26).

Abstract: Methods for performing a hybridization assay between a target biomolecule and an array comprising a surface to which are attached biomolecular probes with different, known sequences, at discrete, known locations, the method comprising: providing a container holding a hybridization mixture comprising the target biomolecule and also holding the array; and creating a temperature gradient in the hybridization mixture oriented within the container such that at least a portion of the target biomolecule is driven onto the surface of the array.

Abstract: An apparatus and method for performing hybridization or binding assays under thermophoretic conditions is provided.

Abstract: An apparatus and method for conditioning a pad used for chemical-mechanical planarization (CMP) are provided, that allow the conditioning to be performed in situ without stopping the polishing. A retractable pad-conditioning structure, e.g., conditioning tips, is positioned along the bottom perimeter of a wafer carrier. While polishing a surface of a wafer held in the middle of the wafer carrier, whenever the removal rate drops below a permissible value, the pad-conditioning structure, which rotates in unison with the wafer carrier, is lowered to contact the pad to condition the pad's surface. Since an area of the pad used for polishing the wafer is always surrounded by already conditioned pad areas and the area for polishing moves as the wafer carrier moves around on the pad surface, a substantially uniform removal rate is maintained. When the pad is sufficiently conditioned, the conditioning structure is retracted until the pad needs to be conditioned again.

Abstract: An apparatus and method for performing hybridization or binding assays under thermophoretic conditions is provided.

Abstract: An apparatus and method for conditioning a pad used for chemical-mechanical planarization (CMP) are provided, that allow the conditioning to be performed in situ without stopping the polishing. A retractable pad-conditioning structure, e.g., conditioning tips, is positioned along the bottom perimeter of a wafer carrier. While polishing a surface of a wafer held in the middle of the wafer carrier, whenever the removal rate drops below a permissible value, the pad-conditioning structure, which rotates in unison with the wafer carrier, is lowered to contact the pad to condition the pad's surface. Since an area of the pad used for polishing the wafer is always surrounded by already conditioned pad areas and the area for polishing moves as the wafer carrier moves around on the pad surface, a substantially uniform removal rate is maintained. When the pad is sufficiently conditioned, the conditioning structure is retracted until the pad needs to be conditioned again.

Abstract: A CMP heterodyne in-situ sensor (C-HIS) system utilizes optical heterodyne interferometry. A wafer undergoing CMP is illuminated through the wafer thickness using an infrared laser beam at a wavelength of 1.1 &mgr;m or greater. The beam is transmitted through the wafer and is reflected from the front wafer surface. As the wafer is polished, the optical beam path through the wafer is shortened, causing the reflected optical frequency to undergo a Doppler shift. By measuring this shift, the change in wafer thickness is determined. The frequency shift generates a signal, which enables dynamic process control. In embodiments where the wafer includes a planarization film, the frequency shift provides a measurement of changing film thickness. Embodiments of the invention utilize phase detection independent of intensity, and hence do not suffer from intensity fluctuations. Some embodiments detect thickness changes less than 2.5 nm. C-HIS sensors operate in both polished-to-thickness and polished-to-stop scenarios.

Abstract: In a CMP method and apparatus an essentially circular polishing pad is mounted on a rotating platen. A region of the polishing pad is thinned to provide enhanced optical transparency. A portion of the platen underlying the thinned pad region is also transparent. The thinned pad and the transparent platen portion provide optical access to the surface of a wafer for in-situ process monitoring. Input signals from optical monitoring instruments enable dynamic process control.

Abstract: A highly linear, low-distortion H-bridge amplifier is described. The amplifier includes four interconnected power transistors connected to an inductive load. Each transistor has a precision voltage clamp connected between the source and drain to suppress ringing oscillations. Two or more of the transistors also include high-speed transient-voltage suppressers connected in parallel with their respective voltage clamps. These transient-voltage suppressers do not have the clamping accuracy of the voltage clamps, but respond much more quickly to suppress noise spikes. The amplifier therefore takes advantage of both the fast response time of the transient-voltage suppressers and the precise voltage-clamping characteristics of the voltage clamps.