Abstract: An optical device includes an array of light-emitting elements, including a first subset of light-emitting elements and a second subset of light-emitting elements. The first subset of light-emitting elements is configured to emit light having wavelength L1. The device includes a high refractive index material selectively disposed on the second subset of light-emitting elements and an array of optical elements positioned so as to be illuminated by the first subset of light-emitting elements and by the second subset of light-emitting elements. The optical elements are regularly arranged in a common plane at a pitch P, the common plane is located a distance D from the array of light-emitting elements, and P2?2L1D/N, N being an integer greater than or equal to 1.

Abstract: The present invention relates to methods for embedded a micrometer and/or nanometer pattern into an injection molding tool. In a first main aspect, a micro/nanometer structured imprinting device is applied in, or on, an active surface so as to transfer the micro/nanometer patterned structure to the tool while the imprinting device is, at least partly, within a cavity of the injection molding tool. In a second main aspect, a base plate with a micro/nanometer structured pattern positioned on an upper part is positioned on the active surface within the tool, the lower part of the base plate facing the tool, the active surface receiving the base plate being non-planar on a macroscopic scale. Both aspects enable a simple and effective way of transferring the pattern, and the pattern may be transferred on the active working site of tool immediately prior to molding without the need for extensive preparations or remounting of the tool before performing the molding process.

Abstract: The present invention relates to a method for performing high speed electron beam lithography (EBL). An electron beam source (EBS), capable of emitting an electron beam towards the energy sensitive resist, forms a first pattern (P1) on the substrate, the first pattern defining a first direction (D1) on the substrate. The electron beam source then forms a second pattern (P2) on the substrate. The energy and/or dose delivered to the energy sensitive resist during the exposure of the first and the second pattern is dimensioned so that the threshold dose/energy of the energy sensitive resist is reached on the overlapping portions of the first and the second patterns (P1, P2). The invention provides a high speed technique for the production of substrates with high quality developed patterns, e.g. hole or dot arrays, by electron beam lithography. Each hole or dot may be defined by the mutually overlapping portions of the first and second pattern, e.g.

Abstract: The invention relates to an imprinting device for imprinting nano/micro structures. The imprinting device comprises a second expandable cavity constituted in part by a membrane of the stamp. The membrane is flexible and formed in such a way so that when fluid is pumped into the expandable cavity then the membrane expands towards the imprintable substrate and imprints the substrate. The imprinting device is further provided with a force provider, alternatively a first expandable cavity, for forcing a contact part of the substrate to make contact with a matching contact part of the stamp.

Abstract: The present invention relates to methods for embedded a micrometer and/or nanometer pattern into an injection molding tool. In a first main aspect, a micro/nanometer structured imprinting device is applied in, or on, an active surface so as to transfer the micro/nanometer patterned structure to the tool while the imprinting device is, at least partly, within a cavity of the injection molding tool. In a second main aspect, a base plate with a micro/nanometer structured pattern positioned on an upper part is positioned on the active surface within the tool, the lower part of the base plate facing the tool, the active surface receiving the base plate being non-planar on a macroscopic scale. Both aspects enable a simple and effective way of transferring the pattern, and the pattern may be transferred on the active working site of tool immediately prior to molding without the need for extensive preparations or remounting of the tool before performing the molding process.

Abstract: The present invention relates to a nano-imprinting stamp for imprinting nanometer-sized to mm-sized structures, the stamp (1) having a base part and a first and a second imprinting section (2,3), the first and second imprinting sections having a lithographic pattern (7) intended for imprinting in a receiving substrate. In a first aspect, the first and the second imprinting sections (2,3) are independently displaceable in a direction substantially parallel to an imprinting direction of the imprinting stamp. In a second aspect, the first and the second imprinting sections (2,3) are mechanically weakly coupled in a direction substantially parallel to an imprinting direction of the imprinting stamp. The stamp limits the effect of imperfections in or on the substrate to be imprinted with a lithographic pattern (7) and imperfections in or on the stamp and any combinations of such imperfections by localising the bending of the stamp to the base part (5) in-between the imprinting sections (2,3).