Abstract: A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demolding, so as to prevent damage to the molded base, and to avoid stray light.
Type:
Grant
Filed:
March 16, 2017
Date of Patent:
June 5, 2018
Assignee:
Ningho Sunny Opotech Co., Ltd.
Inventors:
Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng