Patents Assigned to NIPPON DICS CO.
  • Patent number: 10224681
    Abstract: A multipole plug 1 is configured in such a manner that a first terminal strip (first terminal strip 15) is provided with first flow holes (second flow holes 15D) in a first curved plate portion 15B, a second terminal strip (second terminal strip 17) is provided with a second flow holes (third flow holes 17D) in a second curved plate portion 17B, and the first curved plate portion 15B and the second curved plate portion 17B are positioned by the positioning ring 20 provided with an outer projecting portions 20B to be fitted to notched portions 18F of a first sleeve portion (second sleeve 18) and an inner projecting portions 20C to be fitted into a gap between the first curved plate portion 15B and the second curved plate portion 17B being fitted thereto.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: March 5, 2019
    Assignee: NIPPON DICS CO., LTD.
    Inventor: Eiji Kikuchi
  • Publication number: 20180301856
    Abstract: A multipole plug 1 is configured in such a manner that a first terminal strip (first terminal strip 15) is provided with first flow holes (second flow holes 15D) in a first curved plate portion 15B, a second terminal strip (second terminal strip 17) is provided with a second flow holes (third flow holes 17D) in a second curved plate portion 17B, and the first curved plate portion 15B and the second curved plate portion 17B are positioned by the positioning ring 20 provided with an outer projecting portions 20B to be fitted to notched portions 18F of a first sleeve portion (second sleeve 18) and an inner projecting portions 20C to be fitted into a gap between the first curved plate portion 15B and the second curved plate portion 17B being fitted thereto.
    Type: Application
    Filed: June 20, 2018
    Publication date: October 18, 2018
    Applicant: NIPPON DICS Co., Ltd.
    Inventor: Eiji KIKUCHI
  • Patent number: 10063020
    Abstract: A multipole plug 1 is configured in such a manner that a first terminal strip (first terminal strip 15) is provided with first flow holes (second flow holes 15D) in a first curved plate portion 15B, a second terminal strip (second terminal strip 17) is provided with a second flow holes (third flow holes 17D) in a second curved plate portion 17B, and the first curved plate portion 15B and the second curved plate portion 17B are positioned by the positioning ring 20 provided with an outer projecting portions 20B to be fitted to notched portions 18F of a first sleeve portion (second sleeve 18) and an inner projecting portions 20C to be fitted into a gap between the first curved plate portion 15B and the second curved plate portion 17B being fitted thereto.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: August 28, 2018
    Assignee: NIPPON DICS CO., LTD.
    Inventor: Eiji Kikuchi
  • Publication number: 20180191110
    Abstract: A multipole plug 1 is configured in such a manner that a first terminal strip (first terminal strip 15) is provided with first flow holes (second flow holes 15D) in a first curved plate portion 15B, a second terminal strip (second terminal strip 17) is provided with a second flow holes (third flow holes 17D) in a second curved plate portion 17B, and the first curved plate portion 15B and the second curved plate portion 17B are positioned by the positioning ring 20 provided with an outer projecting portions 20B to be fitted to notched portions 18F of a first sleeve portion (second sleeve 18) and an inner projecting portions 20C to be fitted into a gap between the first curved plate portion 15B and the second curved plate portion 17B being fitted thereto.
    Type: Application
    Filed: May 11, 2017
    Publication date: July 5, 2018
    Applicant: NIPPON DICS Co., Ltd.
    Inventor: Eiji KIKUCHI
  • Publication number: 20080020628
    Abstract: To provide a speaker cable plug which is high in performance and easy to use, a speaker terminal for connection to such plug, and a speaker terminal system using such plug and terminal as a set.
    Type: Application
    Filed: March 2, 2004
    Publication date: January 24, 2008
    Applicant: NIPPON DICS CO.
    Inventor: Eiji Kikuchi
  • Patent number: 7204719
    Abstract: A connector including a plurality of terminal wires forming gently-sloping hills in a longitudinal direction and having curved front and rear opposite end portions and wire retaining bodies each of which has substantially the same length as the wires to partially cover front half sides and rear half sides of one faces of the wires without contact and to restrain and retain intermediate portions of the wires. The two wire retaining bodies are combined into combined wire retaining bodies in such a manner that the curved opposite end portions of the retained wires face each to form terminal pinching portions. The combined wire retaining bodies are housed in a cylindrical connector casing having front and rear opposite open ends. The front and rear terminal pinching portions of the retaining bodies face the front and rear open end portions of the connector casing.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: April 17, 2007
    Assignee: Nippon Dics Co., Ltd.
    Inventor: Eiji Kikuchi
  • Publication number: 20070026730
    Abstract: It is an object of the present invention to achieve solderless connection with a connector of a type to be plugged in a board and a plug to be plugged in the connector, improvements having been made in a cost of metal molds and a cost of manufacturing of the connector by simplifying structures of the metal molds and making it possible to assemble the connector on an automatic assembly line. To achieve this object, the invention provides the connector including a plurality of terminal wires forming gently-sloping hills in a longitudinal direction and having curved front and rear opposite end portions and wire retaining bodies each of which has substantially the same length as the wires to partially cover front half sides and rear halt sides of one faces of the wires without contact and to restrain and retain intermediate portions of the wires.
    Type: Application
    Filed: July 28, 2006
    Publication date: February 1, 2007
    Applicant: NIPPON DICS CO., LTD.
    Inventor: Eiji KIKUCHI
  • Patent number: 7097497
    Abstract: A plug for the speaker cables of the invention comprises a plug main body involving terminal loading slots for positive and negative polarities on the front thereof, loading slots for cables in response to both polarities on the rear thereof, and a hollow inside thereof, wherein first tongues for holding terminals functioning to hold speaker terminals are inserted from the terminal loading slots from the external surface thereof by spring action, second tongues for holding cables connected to the tongues for holding terminals and functioning to hold stranded wires of speaker cables are inserted from the cable loading slots from the external surface thereof by spring action, and third tongues for holding cables are formed so as to expand sections for holding cables by operating pieces disposed so as to be exposed outside the plug main body.
    Type: Grant
    Filed: February 12, 2004
    Date of Patent: August 29, 2006
    Assignee: Nippon Dics Co., Ltd.
    Inventor: Eiji Kikuchi
  • Patent number: 7081011
    Abstract: Contacts are provided wherewith attachment to a board can be made with adequate attachment strength, without requiring soldering, which can be easily removed from the board without causing damage to occur. Parts of wiring rounds 37 positioned at the extreme diagonally lower right point on a printed circuit board 31 are clamped from above and below by the upper portion of a wiring round side contact part W, indicated by solid lines, facing on a slit 39 positioned at the extreme diagonally lower right point in a base 19, and by the lower portion of a wiring round side contact part W indicated by broken lines. The part of the wiring rounds 37 is clamped by the wiring round side contact part W, by spring forces that operate in directions to tighten that part, which spring forces develop in the upper portion and the lower portion of the wiring round side contact part W.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: July 25, 2006
    Assignee: Nippon Dics Co., Ltd.
    Inventors: Eiji Kikuchi, Hiroji Yamakawa
  • Patent number: 6951486
    Abstract: Contacts are provided wherewith attachment to a board can be made with adequate attachment strength, without requiring soldering, which can be easily removed from the board without causing damage to occur. Parts of wiring rounds 37 positioned at the extreme diagonally lower right point on a printed circuit board 31 are clamped from above and below by the upper portion of a wiring round side contact part W, indicated by solid lines, facing on a slit 39 positioned at the extreme diagonally lower right point in a base 19, and by the lower portion of a wiring round side contact part W indicated by broken lines. The part of the wiring rounds 37 is clamped by the wiring round side contact part W, by spring forces that operate in directions to tighten that part, which spring forces develop in the upper portion and the lower portion of the wiring round side contact part W.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: October 4, 2005
    Assignee: Nippon Dics Co., Ltd.
    Inventors: Eiji Kikuchi, Hiroji Yamakawa
  • Patent number: 6854983
    Abstract: Contacts are provided wherewith attachment to a board can be made with adequate attachment strength, without requiring soldering, which can be easily removed from the board without causing damage to occur. Parts of wiring rounds 37 positioned at the extreme diagonally lower right point on a printed circuit board 31 are clamped from above and below by the upper portion of a wiring round side contact part W, indicated by solid lines, facing on a slit 39 positioned at the extreme diagonally lower right point in a base 19, and by the lower portion of a wiring round side contact part W indicated by broken lines. The part of the wiring rounds 37 is clamped by the wiring round side contact part W, by spring forces that operate in directions to tighten that part, which spring forces develop in the upper portion and the lower portion of the wiring round side contact part W.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: February 15, 2005
    Assignee: Nippon Dics Co., Ltd.
    Inventors: Eiji Kikuchi, Hiroji Yamakawa
  • Publication number: 20040161962
    Abstract: A plug for the speaker cables of the invention comprises a plug main body involving terminal loading slots for positive and negative polarities on the front thereof, loading slots for cables in response to both polarities on the rear thereof, and a hollow inside thereof, wherein first tongues for holding terminals functioning to hold speaker terminals are inserted from the terminal loading slots from the external surface thereof by spring action, second tongues for holding cables connected to the tongues for holding terminals and functioning to hold stranded wires of speaker cables are inserted from the cable loading slots from the external surface thereof by spring action, and third tongues for holding cables are formed so as to expand sections for holding cables by operating pieces disposed so as to be exposed outside the plug main body.
    Type: Application
    Filed: February 12, 2004
    Publication date: August 19, 2004
    Applicant: Nippon Dics Co., Ltd.
    Inventor: Eiji Kikuchi
  • Patent number: 6719581
    Abstract: A plug for the speaker cables of the invention comprises a plug main body involving terminal loading slots for positive and negative polarities on the front thereof, loading slots for cables in response to both polarities on the rear thereof, and a hollow inside thereof, wherein first tongues for holding terminals functioning to hold speaker terminals are inserted from the terminal loading slots from the external surface thereof by spring action, second tongues for holding cables connected to the tongues for holding terminals and functioning to hold stranded wires of speaker cables are inserted from the cable loading slots from the external surface thereof by spring action, and third tongues for holding cables are formed so as to expand sections for holding cables by operating pieces disposed so as to be exposed outside the plug main body.
    Type: Grant
    Filed: September 23, 2002
    Date of Patent: April 13, 2004
    Assignee: Nippon Dics Co., Ltd.
    Inventor: Eiji Kikuchi
  • Publication number: 20040018770
    Abstract: A plug for the speaker cables of the invention comprises a plug main body involving terminal loading slots for positive and negative polarities on the front thereof, loading slots for cables in response to both polarities on the rear thereof, and a hollow inside thereof, wherein first tongues for holding terminals functioning to hold speaker terminals are inserted from the terminal loading slots from the external surface thereof by spring action, second tongues for holding cables connected to the tongues for holding terminals and functioning to hold stranded wires of speaker cables are inserted from the cable loading slots from the external surface thereof by spring action, and third tongues for holding cables are formed so as to expand sections for holding cables by operating pieces disposed so as to be exposed outside the plug main body.
    Type: Application
    Filed: September 23, 2002
    Publication date: January 29, 2004
    Applicant: NIPPON DICS CO., LTD
    Inventor: Eiji Kikuchi
  • Patent number: 6629851
    Abstract: Contacts are provided wherewith attachment to a board can be made with adequate attachment strength, without requiring soldering, which can be easily removed from the board without causing damage to occur. Parts of wiring rounds 37 positioned at the extreme diagonally lower right point on a printed circuit board 31 are clamped from above and below by the upper portion of a wiring round side contact part W, indicated by solid lines, facing on a slit 39 positioned at the extreme diagonally lower right point in a base 19, and by the lower portion of a wiring round side contact part W indicated by broken lines. The part of the wiring rounds 37 is clamped by the wiring round side contact part W, by spring forces that operate in directions to tighten that part, which spring forces develop in the upper portion and the lower portion of the wiring round side contact part W.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: October 7, 2003
    Assignee: Nippon Dics Co., Ltd.
    Inventors: Eiji Kikuchi, Hiroji Yamakawa
  • Publication number: 20030054695
    Abstract: Contacts are provided wherewith attachment to a board can be made with adequate attachment strength, without requiring soldering, which can be easily removed from the board without causing damage to occur. Parts of wiring rounds 37 positioned at the extreme diagonally lower right point on a printed circuit board 31 are clamped from above and below by the upper portion of a wiring round side contact part W, indicated by solid lines, facing on a slit 39 positioned at the extreme diagonally lower right point in a base 19, and by the lower portion of a wiring round side contact part W indicated by broken lines. The part of the wiring rounds 37 is clamped by the wiring round side contact part W, by spring forces that operate in directions to tighten that part, which spring forces develop in the upper portion and the lower portion of the wiring round side contact part W.
    Type: Application
    Filed: October 16, 2002
    Publication date: March 20, 2003
    Applicant: Nippon Dics Co., Ltd.
    Inventors: Eiji Kikuchi, Hiroji Yamakawa
  • Publication number: 20030045165
    Abstract: Contacts are provided wherewith attachment to a board can be made with adequate attachment strength, without requiring soldering, which can be easily removed from the board without causing damage to occur. Parts of wiring rounds 37 positioned at the extreme diagonally lower right point on a printed circuit board 31 are clamped from above and below by the upper portion of a wiring round side contact part W, indicated by solid lines, facing on a slit 39 positioned at the extreme diagonally lower right point in a base 19, and by the lower portion of a wiring round side contact part W indicated by broken lines. The part of the wiring rounds 37 is clamped by the wiring round side contact part W, by spring forces that operate in directions to tighten that part, which spring forces develop in the upper portion and the lower portion of the wiring round side contact part W.
    Type: Application
    Filed: October 16, 2002
    Publication date: March 6, 2003
    Applicant: Nippon Dics Co., Ltd
    Inventors: Eiji Kikuchi, Hiroji Yamakawa
  • Publication number: 20030045166
    Abstract: Contacts are provided wherewith attachment to a board can be made with adequate attachment strength, without requiring soldering, which can be easily removed from the board without causing damage to occur. Parts of wiring rounds 37 positioned at the extreme diagonally lower right point on a printed circuit board 31 are clamped from above and below by the upper portion of a wiring round side contact part W, indicated by solid lines, facing on a slit 39 positioned at the extreme diagonally lower right point in a base 19, and by the lower portion of a wiring round side contact part W indicated by broken lines. The part of the wiring rounds 37 is clamped by the wiring round side contact part W, by spring forces that operate in directions to tighten that part, which spring forces develop in the upper portion and the lower portion of the wiring round side contact part W.
    Type: Application
    Filed: October 16, 2002
    Publication date: March 6, 2003
    Applicant: Nippon Dics Co., Ltd.
    Inventors: Eiji Kikuchi, Hiroji Yamakawa
  • Patent number: 6524118
    Abstract: Contacts are provided wherewith attachment to a board can be made with adequate attachment strength, without requiring soldering, which can be easily removed from the board without causing damage to occur. Parts of wiring rounds 37 positioned at the extreme diagonally lower right point on a printed circuit board 31 are clamped from above and below by the upper portion of a wiring round side contact part W, indicated by solid lines, facing on a slit 39 positioned at the extreme diagonally lower right point in a base 19, and by the lower portion of a wiring round side contact part W indicated by broken lines. The part of the wiring rounds 37 is clamped by the wiring round side contact part W, by spring forces that operate in directions to tighten that part, which spring forces develop in the upper portion and the lower portion of the wiring round side contact part W.
    Type: Grant
    Filed: October 19, 2000
    Date of Patent: February 25, 2003
    Assignee: Nippon Dics Co., Ltd.
    Inventors: Eiji Kikuchi, Hiroji Yamakawa
  • Patent number: D569344
    Type: Grant
    Filed: November 8, 2005
    Date of Patent: May 20, 2008
    Assignee: Nippon Dics Co., Ltd.
    Inventor: Tomokazu Kawasaki