Patents Assigned to NIPPON ELECTRO-SENSORY DEVICES CORPORATION
  • Defect inspection device and defect inspection method for silicon wafer
    Patent number: 8654191
    Abstract: A defect inspection device for a silicon wafer comprises: an infrared light illumination which illuminates the silicon wafer with a light power that has been adjusted in accordance with a specific resistance value of the silicon wafer; and an imaging unit constituted by a line sensor array that is sensitive to infrared light, which captures the silicon wafer.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: February 18, 2014
    Assignee: Nippon Electro-Sensory Devices Corporation
    Inventor: Manabu Nakamura
  • DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD FOR SILICON WAFER
    Publication number: 20100165095
    Abstract: A defect inspection device for a silicon wafer comprises: an infrared light illumination which illuminates the silicon wafer with a light power that has been adjusted in accordance with a specific resistance value of the silicon wafer; and an imaging unit constituted by a line sensor array that is sensitive to infrared light, which captures the silicon wafer.
    Type: Application
    Filed: December 9, 2008
    Publication date: July 1, 2010
    Applicant: NIPPON ELECTRO-SENSORY DEVICES CORPORATION
    Inventor: Manabu Nakamura