Abstract: A ball arrangement method and arrangement apparatus for simultaneously mounting balls on a mounting object by the steps of holding the balls by suction on ball suction holes in a ball arrangement device having the ball suction holes arranged, transcribing flux or a solder paste onto the balls held by suction, and transferring the balls onto the mounting object. In the method and apparatus, a flux supplying unit composed of a head plate 5 at an end thereof is provided, flux supplying nozzles 7 are arranged over the head plate 5 at positions corresponding to the ball suction holes 6 in the ball arrangement device 1.

Abstract: The present invention relates to a method and an apparatus for arranging fine balls serving as a ball bump particularly on electrodes on a semiconductor chip, electrodes on a semiconductor-mounting substrate, or electrodes on a semiconductor device. It is made possible to remove small-diameter balls by, firstly, using a pre-arrangement plate for arranging the balls and using two diameters for the ball trap holes of the pre-arrangement plate. Secondly, occurrence of a ball suction abnormality and the time required for sucking the balls is reduced by using the pre-arrangement plate and a ball feeder. Thirdly, a ball suction abnormality to the ball arrangement device is determined by detecting the air flow velocity in an evacuation route of the ball arrangement device.