Patents Assigned to NIPPON STEEL & SUMIKIN ELECTRONICS DEVICES INC.
  • Electronic component element housing package
    Patent number: 9119297
    Abstract: An electronic component element housing package is produced by firing a ceramic substrate for housing an electronic component element and a metal layer for bonding to the ceramic substrate to form an electrical path, simultaneously in a reducing atmosphere. The ceramic substrate comprises alumina (Al2O3), a partially stabilized zirconia by forming solid solution with yttria (Y2O3) and a sintering agent. The sintering agent comprises magnesia (MgO), and at least 1 type selected from silica (SiO2), calcia (CaO), or manganese oxides (MnO, MnO2, Mn2O3, Mn3O4).
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: August 25, 2015
    Assignee: Nippon Steel & Sumikin Electronics Devices Inc.
    Inventor: Masanori Nagahiro
  • ELECTRONIC COMPONENT ELEMENT HOUSING PACKAGE
    Publication number: 20130240262
    Abstract: An electronic component element housing package is produced by firing a ceramic substrate for housing an electronic component element and a metal layer for bonding to the ceramic substrate to form an electrical path, simultaneously in a reducing atmosphere. The ceramic substrate comprises alumina (Al2O3), a partially stabilized zirconia by forming solid solution with yttria (Y2O3) and a sintering agent. The sintering agent comprises magnesia (MgO), and at least 1 type selected from silica (SiO2), calcia (CaO), or manganese oxides (MnO, MnO2, Mn2O3, Mn3O4).
    Type: Application
    Filed: May 1, 2013
    Publication date: September 19, 2013
    Applicant: NIPPON STEEL & SUMIKIN ELECTRONICS DEVICES INC.
    Inventor: Masanori Nagahiro