Abstract: A thermal pen of thick film type comprises a thermal pen tip and a thermal pen tip holder connected to the thermal pen tip for holding the thermal pen tip. The thermal pen tip comprises a high resistance substrate formed in the form of a pen point, a heater element formed in the form of a thick film on the end of the pen point of the high resistance substrate and an electric conductor formed in the form of a thick film so as to connect to the heater element. The thermal pen tip is preferably provided with a heat-resistant protective coating to cover the end of the pen point. A heat- and wear-resistant heat-sensitive recording piece is preferably provided in a heat conductive relation to said heater element.

Abstract: A fluorescent display device comprising a glass base plate fitted thereon with, as the main components, fluorescent material-coated segmentary electrodes, controlling grid electrodes and a cathode for emitting thermal electrons, and a glass panel fusion bonded to said glass base plate so as to cover said electrodes, the fusion bond being effected at much lower temperatures than before.

Abstract: An apparatus comprising a grinding unit supported on and movable along a transversal beam provided in a wagon which is movable along a pair of spaced rails. The grinding unit includes a stationary frame on which a transversal beam is movably supported. A shaft member is rotatably mounted in a hollow member secured to said transversal beam and has fork-shaped frames fixed to the lower end thereof. A frame is pivotably supported between the lower ends of the fork-shaped frames and has a shaft bearing sleeve secured to a front portion of said frame. A grinder wheel shaft carries a grinding wheel and is rotatably received in the shaft bearing sleeve. There is provided means for swinging said fork-shaped frames about an axis of said shaft member. Cam means are mounted on the underside of a base member secured to the top of the hollow member to define a gap therebetween.

Abstract: An apparatus comprising a grinding unit supported on and movable along a transversal beam provided in a wagon which is movable along a pair of spaced rails. The grinding unit includes a stationary frame on which a transversal beam is movably supported. A shaft member is rotatably mounted in a hollow member secured to said transversal beam and has fork-shaped frames fixed to the lower end thereof. A frame is pivotably supported between the lower ends of the fork-shaped frames and has a shaft bearing sleeve secured to a front portion of said frame. A grinder wheel shaft carries a grinding wheel and is rotatably received in the shaft bearing sleeve. There is provided means for swinging said fork-shaped frames about an axis of said shaft member. Cam means are mounted on the underside of a base member secured to the top of the hollow member to define a gap therebetween.

Abstract: The upper and lower parts of a split mould are merely superposed together, and an inclined peripheral surface of said upper mould is brought into engagement with claws of a chuck attached to a rotary shaft of forming or moulding machine.

Abstract: A process for the manufacture of printed substrates and decalcomania compositions used therefor comprising a permeable backing paper, water-soluble binder, printed pattern such as hybrid or monolithic circuit, and removable cover coat, these components being laminated one upon another.

Abstract: A method of fabricating a thermal printing head by printing a circuit pattern of resistive elements and electric conductors on one surface of a flat paper sheet, covering the circuit pattern and surface of the flat paper sheet with a carrier layer of a substantially transparent methacrylic acid resin, peeling off the flat paper sheet, placing the remaining carrier layer carrying the circuit pattern over a surface of a pre-shaped insulating substrate with the circuit pattern being laid downward, and heating the carrier layer placed on the substrate to cause the carrier layer to be burned off and cause the circuit pattern to adhere to the surface of the substrate.