Abstract: A key telephone system comprises a plurality of key telephones and a main equipment connected to at least one set of central office (CO) lines and capable of connecting thereto the key telephones. The main equipment includes a dual tone multifrequency (DTMF) sending circuit common to the key telephones, and the respective key telephones are connected to the main equipment through four wiring cables capable of forming one both-way voice frequency talking circuit, two one-way voice frequency talking circuits and one both-way digital data transmitting circuit.
Abstract: A key telephone system comprises a main equipment connected to at least one set of central office (CO) lines and capable of connecting thereto a plurality of key telephones. The main equipment includes a dual tone multifrequency (DTMF) sending circuit common to the key telephones, and the respective key telephones are connected to the main equipment through six wiring cables forming a pair of two-way voice frequency talking circuits and one two-way data transmitting circuit. A plurality of switching matrixes are included in the main equipment for selectively connecting the CO lines and the talking circuits, and also connecting the data transmitting circuit through the DTMF sending circuit to the CO lines and one of the talking circuits in the key telephone, whereby respective functions of hand-free talk-back and off-hook signalling during intercom talking, and speaker monitoring function during CO line talking are performable.
Type:
Grant
Filed:
August 18, 1980
Date of Patent:
August 31, 1982
Assignees:
Nippon Telegraph and Telephone Public Corporation, Nippon Tsushin Kogyo Kabushiki Kaisha
Abstract: A process for producing ceramics to be used as substrates and packages of semiconductor devices, which having a thermal expansion coefficient close to that of silicon used as chip or wafer material of large scale integrations and a mechanical strength and thermal conductivity equal to those of alumina, wherein zircon and clays such as kaolin, ball clay and the like and an additive of one of Li.sub.2 O, TiO.sub.2 and ZnO and another of CoO, Co.sub.2 O.sub.3, Co.sub.3 O.sub.4 and MgO are mixed, molded and fired.