Patents Assigned to NISSAHA CO., LTD.
  • Publication number: 20180228032
    Abstract: [Object] To provide a molding with an integrated electrode pattern in which a band-shaped second film including an electric connecting portion to be connected to an external substrate can be securely fixed to an inner surface of a resin molded body, and to provide a method for manufacturing the molding with an integrated electrode pattern. [Solution] A molding with an integrated electrode pattern includes a resin molded body; a first film 11 that is formed on an inner surface of the resin molded body and that includes an electrode pattern 13 and a first lead-out wire 63 electrically connected to the electrode pattern; and a second film 4 that is band-shaped, that stands on the inner surface of the resin molded body, and that includes a second lead-out wire 15 electrically connected to the first lead-out wire.
    Type: Application
    Filed: May 1, 2017
    Publication date: August 9, 2018
    Applicant: NISSAHA CO., LTD.
    Inventors: Seiichi YAMAZAKI, Toshihiro IGA, Yasuisa TAKINISHI