Abstract: A palladium-nickel alloy plating solutions formed from tetramminepalladous chloride is provided. The tetramminepalladous chloride is soluble in aqueous ammonia plating solution and is also water soluble. This permits replenishment of the palladium in a palladium-nickel plating solution during plating operation merely by adding the tetramminepalladous palladius chloride as a solid which is easily dissolved. The palladium-nickel alloy plating solutions contain between about 5 to 30 g/l of palladium and 5 to 30 g/l of nickel.
Type:
Grant
Filed:
September 18, 1981
Date of Patent:
January 31, 1984
Assignees:
Kabushiki Kaisha Suwa Seikosha, Nisshin Kasei Kabushiki Kaisha