Patents Assigned to NITTO DENKO MATERIALS (MALAYSIA) SDN. BHD.
  • Patent number: 11053415
    Abstract: A pressure-sensitive adhesive tape comprises a backing layer having a first and a second surface; and a first pressure-sensitive adhesive layer affixed to the first surface; wherein the first pressure-sensitive adhesive layer has an adhesive strength of 2.0 N/10 mm to 9.0 N/10 mm in absence of a solvent and the pressure-sensitive adhesive tape has a tensile strength in longitudinal direction of 45 N/15 mm to 80 N/15 mm.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: July 6, 2021
    Assignees: NITTO DENKO MATERIALS (MALAYSIA) SDN. BHD., NITTO DENKO CORPORATION
    Inventor: Lee Lee Chai