Patents Assigned to Nitto-Denko
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Publication number: 20240040705Abstract: A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wiring circuit board in a direction in which the edge extends. The difference between the percentage of the area of the conductive pattern to the area of the insulating base layer and the percentage of the area of the dummy conductive pattern to the area of the dummy formation region is 50% or less.Type: ApplicationFiled: November 1, 2021Publication date: February 1, 2024Applicant: NITTO DENKO CORPORATIONInventors: Rihito FUKUSHIMA, Takahiro IKEDA, Shun SHIGA
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Patent number: 11884796Abstract: Provided is a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board. Specifically, a plate-like composite material including polytetrafluoroethylene and a predetermined filler, and satisfying a predetermined condition serves as a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics even when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board.Type: GrantFiled: June 22, 2022Date of Patent: January 30, 2024Assignee: NITTO DENKO CORPORATIONInventors: Shimpei Yakuwa, Kou Uemura, Shunji Imamura, Tomoyuki Kasagi, Tao Gu
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Publication number: 20240032268Abstract: A radio wave absorber 1a includes a resistive layer 10, a reflector 30, and a dielectric layer 20. The resistive layer 10 includes multilayer carbon nanotubes 11. Moreover, the resistive layer 10 has a specific resistance of 1.5 ?·cm or less. The reflector 30 reflects a radio wave. The dielectric layer 20 is disposed between the resistive layer and the reflector in a thickness direction of the resistive layer 10.Type: ApplicationFiled: November 24, 2021Publication date: January 25, 2024Applicant: NITTO DENKO CORPORATIONInventors: Yosuke Nakanishi, Eri Ueda, Hironobu Machinaga
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Patent number: 11881187Abstract: A polymer dispersion type liquid crystal device includes a pair of transparent substrates; a pair of transparent electrodes provided between the pair of transparent substrates; a liquid crystal layer formed by filling a polymer dispersion type liquid crystal between the pair of transparent electrodes; and a driving circuit that applies a voltage between the pair of transparent electrodes to set the liquid crystal layer to a non-scattering state or a scattering state. The driving circuit applies a direct current voltage that periodically inverts a polarity between the pair of transparent electrodes.Type: GrantFiled: March 4, 2020Date of Patent: January 23, 2024Assignee: NITTO DENKO CORPORATIONInventors: Shigeyasu Mori, Yoshihiro Onishi
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Patent number: 11878487Abstract: A porous resin film for a metal layer laminate board and a metal layer laminate board are provided to suppress damage to a metal layer disposed on an inner peripheral surface of a through hole and to have excellent electrical connection reliability even under the high temperature environment. The porous resin film for a metal layer laminate board is used in lamination of a metal layer. The porous resin film for a metal layer laminate board has a minimum thermal expansion coefficient X in a plane direction perpendicular to a thickness direction and a thermal expansion coefficient Z in the thickness direction. In the porous resin film for a metal layer laminate board, a ratio (Z/X) of the thermal expansion coefficient Z in the thickness direction to the minimum thermal expansion coefficient X is 3.5 or less.Type: GrantFiled: April 19, 2022Date of Patent: January 23, 2024Assignee: NITTO DENKO CORPORATIONInventors: Kei Mishima, Naoto Nagami
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Publication number: 20240017527Abstract: The present multi-layered structure includes: a resin layer; and a glass layer stacked via an adhesive layer on the resin layer. A thickness of the glass layer is 10 ?m or more and 300 ?m or less. A thickness of an outer peripheral portion of the resin layer is 5 ?m or more.Type: ApplicationFiled: November 2, 2021Publication date: January 18, 2024Applicant: Nitto Denko CorporationInventors: Keisuke SATO, Takeshi MURASHIGE, Junichi INAGAKI
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Publication number: 20240023237Abstract: A wiring circuit board includes a first insulating layer and a conductive pattern. The conductive pattern has a first terminal, and a wiring connected to the first terminal. The wiring has a first portion disposed away from the first terminal, and a second portion disposed between the first terminal and the first portion. The first portion of the wiring and the first terminal include a portion consisting of the first conductive layer and the second conductive layer. The second portion of the wiring consists of the first conductive layer.Type: ApplicationFiled: October 26, 2021Publication date: January 18, 2024Applicant: NITTO DENKO CORPORATIONInventors: Rihito FUKUSHIMA, Shusaku SHIBATA, Teppei NIINO
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Patent number: 11873179Abstract: A method of conveying a glass film composite uses a roll-to-roll process for winding a glass film composite wound on a feed roller by a winding roller through a plurality of conveyance rollers. The glass film composite includes an elongated glass film, and linear resin tapes disposed on one side of the glass film along a longitudinal direction of the glass film at both ends in a width direction of the glass film. The method includes a step of conveying the glass film composite from the feed roller to the winding roller through the plurality of conveyance rollers without passing a state in which the glass film composite is bent so that the resin tapes are directed to the inside.Type: GrantFiled: March 11, 2020Date of Patent: January 16, 2024Assignee: NITTO DENKO CORPORATIONInventors: Takeshi Murashige, Junichi Inagaki, Keisuke Sato, Atsushi Kishi
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Publication number: 20240015884Abstract: Provided is a wiring circuit board that includes a metal supporting board; a first metal thin film; an insulating layer; a second metal thin film; and a conductive layer in order toward one side in a thickness direction. The metal supporting board includes a metal supporting layer and a surface metal layer. The surface metal layer is disposed on one surface in the thickness direction of the metal supporting layer and has higher conductivity than the metal supporting layer. The insulating layer has a through hole. The conductive layer has a via portion. The via portion is disposed in the through hole and is electrically connected to the metal supporting board.Type: ApplicationFiled: October 28, 2021Publication date: January 11, 2024Applicant: NITTO DENKO CORPORATIONInventors: Shusaku SHIBATA, Takahiro IKEDA, Teppei NIINO
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Patent number: 11866613Abstract: Provided is a PSA sheet that allows installation of a protection sheet with good shape precision on the surface of an object to be protected. The PSA sheet provided by this invention comprises a substrate whose primary component is a resin film and a PSA layer placed on one face of the substrate. The PSA sheet comprises a protection sheet part which is adhered to an adherend to protect it, a marginal part bounded from the protection sheet part by a tear-off line surrounding the protection sheet part, and a tear-aiding structure provided along the tear-off line. The PSA sheet is configured so that after the protection sheet part is adhered to the adherend, when the marginal part is pulled in a direction in which the PSA sheet is peeled off the adherend, the marginal part is torn off the protection sheet part.Type: GrantFiled: April 25, 2019Date of Patent: January 9, 2024Assignee: NITTO DENKO CORPORATIONInventors: Takeshi Igarashi, Yasunori Yamamoto
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Patent number: 11868036Abstract: The present invention provides a transmissive screen including a light control layer, the screen being reduced in reflection scattering toward an image source, and an image display apparatus using the transmissive screen.Type: GrantFiled: March 27, 2020Date of Patent: January 9, 2024Assignee: NITTO DENKO CORPORATIONInventors: Masanori Otsuka, Hiroyuki Takemoto
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Publication number: 20240008178Abstract: A wiring circuit board includes a metal supporting board; an insulating layer; and a conductive layer in this order in a thickness direction. The conductive layer includes a terminal portion, and a tail line portion extending from the terminal portion. The terminal portion has a via portion that penetrates the insulating layer in the thickness direction and is connected to the metal supporting board. The tail line portion has a base end portion that has a width different from a width of the terminal portion in a direction orthogonal to the extending direction of the tail line portion and that is connected with the terminal portion; and a second via portion that penetrates the insulating layer in the thickness direction and that is connected to the metal supporting board.Type: ApplicationFiled: October 29, 2021Publication date: January 4, 2024Applicant: NITTO DENKO CORPORATIONInventors: Shusaku SHIBATA, Takahiro IKEDA, Teppei NIINO
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Publication number: 20240001644Abstract: The present multi-layered structure includes: a resin layer; a glass layer stacked via an adhesive layer on the resin layer; and a fusion layer that is formed in an outer peripheral portion of the glass layer on the glass layer side that faces the adhesive layer. A thickness of the glass layer is 10 ?m or more and 300 ?m or less. A thickness of the fusion layer is less than 3 ?m.Type: ApplicationFiled: October 26, 2021Publication date: January 4, 2024Applicant: Nitto Denko CorporationInventors: Keisuke SATO, Takeshi MURASHIGE, Junichi INAGAKI
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Publication number: 20240001651Abstract: A multi-layer structure includes a support, a resin layer laminated on the support via a tackifier layer, and a glass layer laminated over the resin layer. The thickness of the glass layer is 10 ?m or greater and 300 ?m or less. When the coefficient of linear expansion of the support is defined as CTE [ppm/° C.], the thickness of the tackifier layer is defined as d [?m], and the elastic modulus of the tackifier layer is defined as E [GPa], a value a, which is defined as a=CTE/(d/E), is 3 or less.Type: ApplicationFiled: October 29, 2021Publication date: January 4, 2024Applicant: NITTO DENKO CORPORATIONInventors: Junichi INAGAKI, Keisuke SATO, Takeshi MURASHIGE
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Publication number: 20230416477Abstract: A fluorine resin film to be provided includes a fluorine resin, wherein the fluorine resin film has an average value of 1200% or more of a tensile elongation at break in a first direction and a tensile elongation at break in a second direction under a 180° C. atmosphere, the first direction and the second direction being in-plane directions and orthogonal to each other. This fluorine resin film can be used as a coating film for coating the surface of a rubber-containing substrate included in a molded rubber body and is suitable for manufacturing a molded rubber body having a surface coated with the film.Type: ApplicationFiled: August 5, 2021Publication date: December 28, 2023Applicant: NITTO DENKO CORPORATIONInventors: Yuta KUROKI, Narumi UEDA, Kurato AKIBA, Keiko FUJIWARA
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Publication number: 20230422397Abstract: A wiring circuit board includes a metal supporting board, first and second metal thin films, an insulating layer, and a conductive layer, where the resistance between the conductive layer and metal supporting board are lowered. The first metal thin film is disposed on one surface of the metal supporting board in the thickness direction, with the insulating layer having a through hole. The second metal thin film is disposed on one surface of the insulating layer in the thickness direction with the conductive layer disposed thereon. In the through hole, the first and second metal thin films, whose surfaces contact, are disposed between the metal supporting board and the conductive layer, and the other surface of the first metal thin film is in contact with the one surface of the metal supporting board. The other surface of the second metal thin film is in contact with the conductive layer.Type: ApplicationFiled: June 21, 2023Publication date: December 28, 2023Applicant: NITTO DENKO CORPORATIONInventors: Takahiro IKEDA, Taketo ISHIKAWA, Yuki TAKEDA, Hironori KUWAYAMA, Kyotaro YAMADA
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Publication number: 20230413431Abstract: A wiring circuit board includes a metal supporting layer, a first metal thin film, an insulating layer including a through hole, a second metal thin film disposed on the first metal thin film in the through hole, and a conductive pattern electrically connected to the metal supporting layer through the first metal thin film and the second metal thin film in the through hole. The first metal thin film includes an oxide coating at least on a contact surface in contact with the insulating layer. In the central part of the through hole, the oxide coating has a thickness of 0 or a thickness smaller than a thickness of the oxide coating on the contact surface.Type: ApplicationFiled: June 6, 2023Publication date: December 21, 2023Applicant: NITTO DENKO CORPORATIONInventors: Takahiro IKEDA, Kyotaro YAMADA, Taketo ISHIKAWA, Hironori KUWAYAMA, Yuki TAKEDA
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Publication number: 20230411061Abstract: A laminated sheet includes a sheet-shaped inductor including a plurality of wirings and a magnetic layer embedding the plurality of wirings, and a processing stability layer disposed on at least one surface in a thickness direction of the inductor. The magnetic layer includes a binder and a magnetic particle having a generally flat shape and whose material is a metal. The processing stability layer includes a cured product of a thermosetting resin composition. The thermosetting resin composition includes a thermosetting resin as an essential component. The thermosetting resin composition includes at least one kind of particle, as an optical component, selected from the group consisting of a first particle having a generally spherical shape and a second particle having a generally flat shape and whose material is an inorganic compound.Type: ApplicationFiled: August 24, 2023Publication date: December 21, 2023Applicant: NITTO DENKO CORPORATIONInventors: Yoshihiro FURUKAWA, Keisuke OKUMURA
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Publication number: 20230402210Abstract: A magnetic sheet has a first principal surface and a second principal surface facing each other in the thickness direction. The magnetic sheet contains magnetic particles and resin. The ratio of the total amount of carbon and oxygen on one of the first principal surface and second principal surface is 10 mass % or more and 60 mass % or less.Type: ApplicationFiled: November 11, 2021Publication date: December 14, 2023Applicant: NITTO DENKO CORPORATIONInventors: Hiroki SENDA, Keisuke OKUMURA, Yoshihiro FURUKAWA
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Publication number: 20230400637Abstract: A method for constructing a plastic optical fiber includes a first step of cutting the plastic optical fiber at a construction site to form end faces of the plastic optical fiber; and a second step of connecting the end faces to wavelength multiplexing optical extenders without polishing the end faces at the same construction site.Type: ApplicationFiled: November 1, 2021Publication date: December 14, 2023Applicant: NITTO DENKO CORPORATIONInventors: Koichi TSUDA, Yusuke SHIMIZU
