Patents Assigned to Nitto-Denko
  • Publication number: 20140287255
    Abstract: Provided are a cutting information determination method that can use a simpler process to improve yield, and a strip-shaped polarizing sheet manufacturing method using such a method, an optical display unit manufacturing method using such a method, a strip-shaped polarizing sheet, and a polarizing sheet material. A cutting position in the width direction A2, in which a polarizing sheet material MP is to be cut along its longitudinal direction A1, is determined based on the numbers of defects counted with respect to plural points in the width direction A2 of the polarizing sheet material MP. This makes it possible to determine the cutting position in such a way that a region with many defects does not fall within the cut width, so that a higher-yield cutting position can be determined. The cutting position can also be determined using a simple process in which defects are counted with respect to plural points in the width direction A2.
    Type: Application
    Filed: June 3, 2014
    Publication date: September 25, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akinori Izaki, Yuu Sugimoto, Seiji Umemoto, Tetsushi Kunitake
  • Publication number: 20140284584
    Abstract: Disclosed herein are compounds represented by the formula: where HT and n are defined herein. Compositions of said compounds along with organic light-emitting diode (OLED) devices related thereto are also disclosed.
    Type: Application
    Filed: March 25, 2014
    Publication date: September 25, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventor: Shijun Zheng
  • Publication number: 20140285888
    Abstract: A retardation film insusceptible to color dropout or color shift even under environment of severe temperature or humidity conditions and capable of being produced by a melt film-forming method. The retardation film is obtained by molding at least one polymer selected from polycarbonate and polyester carbonate each having a glass transition temperature of 110 to 180° C. and satisfies the relationships of the following formulae (A) and (B): 0.7<R1(450)/R1(550)<1??Formula (A): |R2(450)/R2(550)?R1(450)/R1(550)|<0.020.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 25, 2014
    Applicants: NITTO DENKO CORPORATION, MITSUBISHI CHEMICAL CORPORATION
    Inventors: Tomohiko TANAKA, Masashi YOKOGI, Shingo NAMIKI, Yuuichi HIRAMI, Masanori YAMAMOTO, Nao MURAKAMI, Toshiyuki IIDA, Takashi SHIMIZU
  • Publication number: 20140284086
    Abstract: A vibration-proof material is obtained by foaming a rubber composition containing an ethylene-propylene-diene rubber. The content ratio of a sulfur atom calculated based on the measurement result of a fluorescent X-ray measurement, based on mass, is 1000 ppm or less and the vibration-proof material has a Young's modulus at 23° C. of 6.0×105 Pa or less.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 25, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takayuki IWASE, Bunta HIRAI, Eiji MATSUDA
  • Publication number: 20140287225
    Abstract: The present invention provides a transparent heat-resistant non-flammable film that has high transparency, heat resistance, and flame retardancy. The transparent heat-resistant non-flammable film according to the present invention includes a transparent heat-resistant protective layer comprising a polysiloxane resin containing a particulate inorganic oxide as a crosslinking agent on at least one surface of a transparent amorphous thermoplastic resin film having a heat distortion temperature of 250° C. or less. The transparent heat-resistant protective layer preferably has a refractive index in the range of 1.40 to 1.43. The transparent heat-resistant protective layer preferably has a thickness in the range of 1 to 100 ?m.
    Type: Application
    Filed: October 31, 2012
    Publication date: September 25, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Keisuke Hirano, Kohei Doi, Yusuke Sugino, Shigeki Ishiguro
  • Publication number: 20140285926
    Abstract: A hard drive gimbal trace circuit includes: a stainless steel gimbal strut (SGST) configured to support a transducer and nullify a natural pitch angle of a flexure from mechanical-coarse adjustment of the SGST; traces forming a trace structure, and being plastically deformed at a high strain region from the mechanical-coarse adjustment of the SGST; and a first protrusion and a second protrusion being at least partially disposed under the high strain region. The SGST has an edge which is disposed on the transducer side to be spaced apart from the traces in the high strain region and extends substantially parallel to the traces. The first protrusion and the second protrusion extend from the edge in an orthogonal direction to an extending direction of the traces and across the traces, and are disposed side by side in the extending direction of the traces.
    Type: Application
    Filed: April 11, 2014
    Publication date: September 25, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Martin John MCCASLIN, Visit THAVEEPRUNGSRIPORN, Alex Enriquez CAYABAN, Jason Aquinde GOMEZ
  • Publication number: 20140287222
    Abstract: A buffer material is obtained by foaming a rubber composition containing an ethylene-propylene-diene rubber. In the buffer material, the content ratio of a sulfur atom calculated based on the measurement result of a fluorescent X-ray measurement, based on mass, is 1000 ppm or less, the buffer material has a 50% compressive load value of 0.1 N/cm2 or more and 2.0 N/cm2 or less, and the buffer material has a stress relaxation rate in a compressed state of 50% after 10 seconds of compression of 60% or more.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 25, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Bunta HIRAI, Takayuki IWASE
  • Patent number: 8841780
    Abstract: The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: September 23, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Naohide Takamoto, Takeshi Matsumura
  • Patent number: 8841757
    Abstract: An electromagnetic wave shielding layer can be provided on the backside of a semiconductor element that is flip-chip connected to an adherend, and a semiconductor device having the electromagnetic wave shielding layer can be manufactured without deteriorating productivity. The present invention provides a film for the backside of a flip-chip type semiconductor to be formed on the backside of a semiconductor element that is flip-chip connected to an adherend, having an adhesive layer and an electromagnetic wave shielding layer.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: September 23, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Daisuke Uenda, Takeshi Matsumura, Koichi Inoue, Miki Morita
  • Publication number: 20140272200
    Abstract: A pressure-sensitive adhesive layer-attached polarizing film contains a polarizing film containing a polarizer and a transparent protective film provided on at least one side of the polarizer, the polarizing film having a total thickness of 100 ?m or less. A pressure-sensitive adhesive layer is provided on the polarizing film and made from a pressure-sensitive adhesive composition containing a (meth)acryl-based polymer and an antioxidant.
    Type: Application
    Filed: March 5, 2014
    Publication date: September 18, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinsuke Akizuki, Atsushi Yasui, Yuusuke Toyama, Takaaki Ishii
  • Publication number: 20140264141
    Abstract: Provided is an insulating film which can be produced easily at low cost and which is excellent in discharge deterioration resistance and mechanical characteristics. The insulating film includes a polyamide imide resin having a weight average molecular weight of 35,000 to 75,000 and an insulating fine particle having an average primary particle diameter of 200 nm or less.
    Type: Application
    Filed: June 29, 2012
    Publication date: September 18, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shunsuke Masaki, Toshimasa Nishimori, Hiroyuki Fujita, Kazunori Hayashi, Jun Fujiki
  • Publication number: 20140272408
    Abstract: Provided is a water-dispersible acrylic pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive layer that can prevent static build-up at the time of peeling (antistatic properties), is superior in removability, in the ability to prevent an increase in peel strength (adhesive strength) over time among the adhesive properties, as well as in appearance properties (decrease of appearance defects due to dents or the like), and also in less-staining properties on adherends, particularly, in the ability to prevent white staining on adherends in high-humidity environments (the ability to prevent white staining).
    Type: Application
    Filed: October 12, 2012
    Publication date: September 18, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tatsumi Amano, Yu Morimoto, Kazuma Mitsui, Kousuke Yonezaki, Kyoko Takashima
  • Publication number: 20140272201
    Abstract: It is an object of the invention to provide a pressure-sensitive adhesive capable of forming a pressure-sensitive adhesive layer having high resistance to sebum and high resistance to moisture-induced clouding and also having low dielectric constant. The invention relates to a pressure-sensitive adhesive comprising a (meth)acryl-based polymer obtained by polymerization of a monomer component containing 65 to 88 parts by weight of an alkyl (meth)acrylate having an alkyl group of 8 to 22 carbon atoms and 12 to 35 parts by weight of an alkyl (meth)acrylate having a secondary hydroxyl group based on 100 parts by weight of the total amount of the alkyl (meth)acrylate having an alkyl group of 8 to 22 carbon atoms and the alkyl (meth)acrylate having a secondary hydroxyl group.
    Type: Application
    Filed: March 10, 2014
    Publication date: September 18, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Ai TAKEDA, Katsuhiko KAMIYA, Kiyoe SHIGETOMI, Takahiro NONAKA
  • Publication number: 20140268334
    Abstract: The polycarbonate resin of the invention includes a first structural unit derived from a dihydroxy compound represented by a general formula (1), a second structural unit derived from a dihydroxy compound represented by a general formula (2), and a third structural unit derived from at least one dihydroxy compound selected from the group consisting of a dihydroxy compound represented by a general formula (3), a dihydroxy compound represented by a general formula (4), a dihydroxy compound represented by a general formula (5), and a dihydroxy compound represented by a general formula (6), and in which the first structural unit derived from a dihydroxy compound represented by the general formula (1) accounts for 18% by mole or more of the polycarbonate resin. The above general formulae (1) to (6) are described in the specification of the present application.
    Type: Application
    Filed: May 30, 2014
    Publication date: September 18, 2014
    Applicants: MITSUBISH CHEMICAL CORPORATION, NITTO DENKO CORPORATION
    Inventors: Tomohiko TANAKA, Masashi YOKOGI, Nao MURAKAMI, Toshiyuki IIDA
  • Publication number: 20140268333
    Abstract: An object of the present invention is to provide a retardation film succeeded in solving those conventional problems, that is, a retardation film insusceptible to color dropout or color shift even under environment of severe temperature or humidity conditions and capable of being produced by a melt film-forming method. The retardation film of the present invention satisfies the relationships of the following formulae (A) and (B): 0.7<R1(450)/R1(550)<1??Formula (A): |R2(450)/R2(550)?R1(450)/R1(550)|<0.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicants: NITTO DENKO CORPORATION, MITSUBISHI CHEMICAL CORPORATION
    Inventors: Tomohiko TANAKA, Masashi Yokogi, Nao Murakami, Toshiyuki IIDA
  • Patent number: 8837874
    Abstract: An opto-electric hybrid board capable of suppressing the increase in light propagation losses and excellent in flexibility, and a method of manufacturing the same, are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer. The metal layer is formed between the cladding layer and the insulative layer. At least part of the metal layer is formed in one of first and second patterns. The first pattern includes a distribution of dot-shaped protrusions, and the second pattern includes a distribution of dot-shaped recesses. A first cladding layer fills a site where the metal layer is removed by the patterning.
    Type: Grant
    Filed: April 19, 2013
    Date of Patent: September 16, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yuichi Tsujita, Yasuto Ishimaru, Hiroyuki Hanazono, Naoyuki Tanaka, Yasufumi Yamamoto, Shotaro Masuda, Mayu Ozaki
  • Patent number: 8835767
    Abstract: A suspension board with circuit includes an insulating base layer and a conductive pattern that is laminated on a top surface of the insulating base layer. The conductive pattern includes a wire and a terminal portion that is connected to the wire for being joined by a melted metal. The insulating base layer, in a projected surface when projected in a laminating direction, includes an adjacent region that is adjacent to the terminal portion and a separated region that is separated from the terminal portion so as to sandwich the adjacent region with the terminal portion. The adjacent region is formed to be thinner than the separated region.
    Type: Grant
    Filed: January 27, 2012
    Date of Patent: September 16, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Saori Ishigaki, Hitoki Kanagawa, Yoshito Fujimura
  • Patent number: 8837873
    Abstract: Provided are an opto-electric hybrid board and a manufacturing method therefor. An optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of an undercladding layer and an overcladding layer, and the protruding portions are located and formed at predetermined locations with respect to a light transmitting surface of a core. An electric circuit unit includes a bent portion having fitting holes into which the protruding portions fit and having an optical element. The fitting holes are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding portions fit into the fitting holes to form an opto-electric hybrid board.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: September 16, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Akiko Nagafuji, Yuichi Tsujita, Masayuki Hodono, Masami Inoue, Mitsuru Honjo
  • Patent number: 8835656
    Abstract: The invention provides a universal linker capable of synthesizing nucleic acid having a hydroxy group at the 3? terminal, a universal support carrying the linker, and a synthesis method of nucleic acid using the universal support. The linker contains a compound represented by the formula wherein each symbol is as defined in the specification.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: September 16, 2014
    Assignees: Nitto Denko Corporation, National University Corporation Nagoya University
    Inventors: Masaki Tsukamoto, Noritaka Suzuki, Yoshihiro Hayakawa, Eri Maeta, Kenjiro Mori, Kenjiro Minomi
  • Publication number: 20140256540
    Abstract: Photocatalytic materials are described herein which include thin nanostructures. For example, the catalytic material can include a nanostructure that has a thin structure of a photocatalytic composition, wherein the thin structure is defined by a first surface and a second surface on opposite sides of the thin structure of the photocatalytic composition. The photocatalytic composition may include an inorganic compound, such as a titanium and/or stannous oxide. The first surface and a second surface may be relatively large as compared to the thickness of the thin structure, or the thickness of the nanostructure.
    Type: Application
    Filed: September 6, 2013
    Publication date: September 11, 2014
    Applicant: Nitto Denko Corporation
    Inventors: Ekambaram Sambandan, Rajesh Mukherjee, Takuya Fukumura, Amane Mochizuki