Abstract: The present invention relates to a method for prevention of premature polymerization during the preparation, purification, transportation and storage of a polymerizable compound with at least one conjugated unsaturated group in the presence of an azine dye-based compound as inhibitor. Further the present invention relates to methods of preparing such inhibitors as well as to the inhibitors itself, as well as to methods of improving solubility and stability of dissolved inhibitors.

Abstract: The present invention relates to a method for prevention of premature polymerization during the preparation, purification, transportation and storage of a polymerizable compound with at least one conjugated unsaturated group in the presence of an azine dye-based compound as inhibitor. Further the present invention relates to methods of preparing such inhibitors as well as to the inhibitors itself, as well as to methods of improving solubility and stability of dissolved inhibitors.

Abstract: The present invention provides pressure-sensitive adhesive films with a favourable visual appearance and surface printability without discoloration and burrs on the cutting edge after short-wavelength laser machining. At the same time, the PSA films of the present invention exhibit a favourable cuttability, allowing for high fiber laser as well as carbon dioxide laser cutting speeds. Since the use of the PSA films of the present invention as surface protecting films does not require extensive cleaning and polishing operations after the cutting process and the cutting process itself may be accelerated, the efficiency of laser machining methods may be improved.

Abstract: The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.