Abstract: A device for cooling, in particular electronic components, in particular of a processor unit, having an evaporator for the absorption of heat in a coolant in particular by means of evaporation; a gas cooler for cooling of the coolant in particular by means of condensation; a first coolant conduit for communicating connection of an evaporator outlet with a gas cooler inlet; a second coolant conduit for communicating connection of a gas cooler outlet with an evaporator inlet; a filling device for filling of the device with coolant; and the filling device is arranged on the evaporator or on the gas cooler.