Abstract: A production method for water for pure water includes adding polyaluminum chloride to raw water to produce first treated water, and filtering the first treated water in two or more stages including filtering with a filtration membrane device in a preceding stage to produce first concentrated water, and filtering the first concentrated water with a filtration membrane device in a subsequent stage. The water for pure water is produced as permeated water produced by the filtering in the two or more stages.

Abstract: A method and apparatus for producing water for pure water, the method and apparatus capable of efficiently adding agents to water to be supplied to a reverse osmosis membrane. The method for producing water for pure water includes: obtaining first treated water by adding a polyaluminum chloride to raw water containing free chlorine; obtaining second treated water by adding a reducing agent containing sodium disulfite as an active ingredient to the first treated water; and treating the second treated water with a reverse osmosis membrane.

Abstract: A desalination apparatus 12 (liquid treatment apparatus) includes a first water treatment unit 26 (liquid treatment unit) that includes a reverse osmosis membrane and in which a treated liquid is separated into a permeate that permeates the reverse osmosis membrane and a concentrate other than the permeate, a water recovery unit 28 (liquid recovery unit) that includes a reverse osmosis membrane and in which the concentrate is separated into a recovered liquid that permeates the reverse osmosis membrane and a waste liquid other than the recovered liquid, and a pressure increasing means that increases a liquid pressure of the concentrate, such that a state capable of separating into the recovered liquid and the waste liquid in the liquid recovery unit continues, and that directly feeds the concentrate from the liquid treatment unit to the liquid recovery unit.

Abstract: An electrode water recovery method is an electrode water recovery method for removing hydrogen gas from electrode water generated by passage of water to be treated through a cathode chamber in an electric deionization treatment and recovering the electrode water in an ultrapure water production step, in which the electrode water is sprayed onto a filling material with which a scrubber is filled, an inert gas is supplied from below the filling material to react with the hydrogen gas in the electrode water, a treated gas generated by the reaction is exhausted from an exhaust port above the filling material, and treated water from which the hydrogen gas has been removed is recovered.

Abstract: A liquid-sealed vacuum pump operating method includes: discharging a liquid from a vacuum pipe connected to a liquid-sealed vacuum pump; supplying a sealing liquid under pressure to the liquid-sealed vacuum pump such that the liquid-sealed vacuum pump contains a predetermined amount of the sealing liquid, and driving the liquid-sealed vacuum pump until a pressure in the vacuum pipe is reduced to a predetermined pressure; and stopping supply of the pressurized sealing liquid to the liquid-sealed vacuum pump in a case in which the pressure in the vacuum pipe is reduced to the predetermined pressure, and circulating the sealing liquid in a circulation flow path from the liquid-sealed vacuum pump to maintain a state in which the predetermined amount of the sealing liquid is present in the liquid-sealed vacuum pump.

Abstract: A measurement device irradiates water to be treated taken in from a main flow path with ultraviolet rays, and then measures an amount of dissolved oxygen after irradiation in the water to be treated, measures an amount of non-irradiated dissolved oxygen in the water to be treated taken in from the main flow path without irradiating the water to be treated with ultraviolet rays, and compares the amount of dissolved oxygen after irradiation and the amount of non-irradiated dissolved oxygen in the water to be treated flowing through the same position of the main flow path at the same timing, and measures an amount of at least one of an oxidizing agent and a reducing agent in the water to be treated flowing through the main flow path based on a comparison result.

Abstract: In a water treatment method, a reducing agent injector adds a reducing agent to water to be treated, and an ultraviolet irradiater irradiates the water to be treated to which the reducing agent has been added with ultraviolet rays to decompose urea.

Abstract: A test substance detection method includes: a step A in which a sample containing a test substance and water, a compound having a structure in which a response site and a recognition site are connected via a spacer, and a surfactant are added; and a step B in which the recognition site and the test substance interact and a response at the response site arising from the interaction is detected. Further, also provided are: a purified water production method and an injection water production method both using the foregoing; a detection agent composition containing a compound represented by Formula (1) and a surfactant; and a detection apparatus, a purified water production facility, and an injection water production facility, all using the foregoing.

Abstract: A method for starting up a hot ultrapure water production system that produces hot ultrapure water by heating ultrapure water to a supply water temperature, for supplied to a point of use, the method involving: alternately passing heated water and cooled water through a hot ultrapure water pipe through which the hot ultrapure water flows, the heated water being obtained by heating the ultrapure water to a temperature higher than room temperature and the cooled water being obtained by cooling the ultrapure water to a temperature lower than the temperature of the heated water in a range of from room temperature to the supply water temperature.

Abstract: A method of detecting an endotoxin of detecting an endotoxin from a test subject sample using a fluorescent substance having a structure in which a fluorescent site and a recognition site are connected by a spacer, wherein the recognition site recognizes a specific site of a molecular structure of an endotoxin.

Abstract: A method for starting up a hot ultrapure water production system that produces hot ultrapure water by heating ultrapure water to a supply water temperature, for supplied to a point of use, the method involving: alternately passing heated water and cooled water through a hot ultrapure water pipe through which the hot ultrapure water flows, the heated water being obtained by heating the ultrapure water to a temperature higher than room temperature and the cooled water being obtained by cooling the ultrapure water to a temperature lower than the temperature of the heated water in a range of from room temperature to the supply water temperature.

Abstract: A desalination apparatus 12 (liquid treatment apparatus) includes a first water treatment unit 26 (liquid treatment unit) that includes a reverse osmosis membrane and in which a treated liquid is separated into a permeate that permeates the reverse osmosis membrane and a concentrate other than the permeate, a water recovery unit 28 (liquid recovery unit) that includes a reverse osmosis membrane and in which the concentrate is separated into a recovered liquid that permeates the reverse osmosis membrane and a waste liquid other than the recovered liquid, and a pressure increasing means that increases a liquid pressure of the concentrate, such that a state capable of separating into the recovered liquid and the waste liquid in the liquid recovery unit continues, and that directly feeds the concentrate from the liquid treatment unit to the liquid recovery unit.

Abstract: A chelate complex is removed from a chemical which is used in a semiconductor production process and contains a compound having a chelating ability, and the cleaning load is also reduced. Specifically disclosed is a method for purifying a chemical which is used in a semiconductor production process and contains a compound having a chelating ability, wherein a chelate complex which is formed from impurity metals such as nickel and copper contained in an alkaline chemical is removed from the chemical by treating the alkaline chemical with an organic complex adsorbing material.

Abstract: Foreign substances which are not inherently contained in a polishing slurry are selectively separated and removed from a polishing slurry component comprised of abrasives, a solvent and an additive which are inherently contained in the polishing slurry.

Abstract: A method for measuring the number of fine particles in ultrapure water includes subjecting the ultrapure water to internal pressure filtration through a hollow fiber membrane having a skin layer capable of trapping the fine particles in the ultrapure water at least on an inner surface thereof, exposing the inner surface of the hollow fiber membrane, and measuring the number of fine particles on the exposed inner surface.

Abstract: A material for purification of a semiconductor polishing slurry that without changing of pH value, is capable of efficiently purifying a polishing slurry to thereby not only prevent metal contamination of a polished object as effectively as possible but also achieve recycling of a polishing slurry without any problem; a relevant module for purification of a semiconductor polishing slurry; and a process for purifying a semiconductor polishing slurry with the use thereof. In particular, a material for purification of a semiconductor polishing slurry characterized in that it comprises a fibrous substrate having a functional group capable of forming a metal chelate or such a functional group together with hydroxyl fixed onto at least the surface thereof. This material for purification of a semiconductor polishing slurry is, for example, used in such a manner that it is inserted in a container fitted with polishing slurry inflow port and outflow port while ensuring passage of polishing slurry flow.

Abstract: Pure water 3 is made to pass through a carbon dioxide contact mechanism, to become carbonated water, and is supplied to an ozone gas and hydrogen gas generation section, so that the concentration of generated ozone gas becomes stable. As a result, the concentration of the generated ozone gas is high and stable, and a high concentration can be maintained.

Abstract: A material for purification of a semiconductor polishing slurry that without changing of pH value, is capable of efficiently purifying a polishing slurry to thereby not only prevent metal contamination of a polished object as effectively as possible but also achieve recycling of a polishing slurry without any problem; a relevant module for purification of a semiconductor polishing slurry; and a process for purifying a semiconductor polishing slurry with the use thereof. In particular, a material for purification of a semiconductor polishing slurry characterized in that it comprises a fibrous substrate having a functional group capable of forming a metal chelate or such a functional group together with hydroxyl fixed onto at least the surface thereof. This material for purification of a semiconductor polishing slurry is, for example, used in such a manner that it is inserted in a container fitted with polishing slurry inflow port and outflow port while ensuring passage of polishing slurry flow.

Abstract: A novel measuring method which allows measurement of fine particles which are extremely fine and contained in a very small amount in ultrapure water is provided. The number frequency with respect to the fine particles having a particle diameter of 0.1 ?m or more is measured based on the finding that the fine particles contained in the ultrapure water at the use point of an ultrapure water production system exhibits a logarithmic normal distribution to determine the logarithmic normal distribution of the fine particles contained in the ultrapure water, and the number of the fine particles having a particle diameter of less than those of the measured particles contained in the ultrapure water is obtained from the distribution.

Abstract: An electronic device substrate, such as a semiconductor silicon wafer or a liquid crystal glass substrate, with a surface which has just undergone cleaning treatment and which is covered with a clean oxide or nitride film which will readily adsorb organic contaminants is treated with an aqueous solution containing choline, or alternatively a similar substrate which has not been cleaned is treated with a treatment solution comprising a SC-1 solution to which choline has been added. Following drying, a surface concentration of choline of between 5×1010 molecules˜7×1012 molecules/cm2 is adsorbed onto the substrate surface. This treatment suppresses organic contamination of the substrate from the atmosphere. As a result, the surface carbon concentration of an electronic device substrate can be suppressed to a value of no more than approximately 3×1013 atoms/cm2, even for manufacturing processes carried out in typical clean rooms with no chemical filters installed.