Patents Assigned to Nomura Plating Co., Ltd.
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Patent number: 9183965Abstract: A film is formed under vacuum by a step of purifying and/or flattening the base material (13) by irradiating the base material (13) with a gas cluster ion beam (4a); by a step of forming an intermediate layer film by evaporating/vaporizing an intermediate layer film forming material, allowing the evaporated/vaporized material to adhere to the surface of the base material (13), and irradiating the intermediate layer film forming material with a gas cluster ion beam (4a); and by evaporating/vaporizing a carbon film forming material containing a carbonaceous material containing substantially no hydrogen, and a boron material, allowing the evaporated/vaporized material to adhere to the surface of the intermediate layer film, and irradiating the carbon film forming material with a gas cluster ion beam (4a).Type: GrantFiled: November 28, 2011Date of Patent: November 10, 2015Assignee: NOMURA PLATING CO., LTD.Inventors: Teruyuki Kitagawa, Shuhei Nomura
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Publication number: 20150037568Abstract: A film is formed under vacuum by a step of purifying and/or flattening the base material (13) by irradiating the base material (13) with a gas cluster ion beam (4a); by a step of forming an intermediate layer film by evaporating/vaporizing an intermediate layer film forming material, allowing the evaporated/vaporized material to adhere to the surface of the base material (13), and irradiating the intermediate layer film forming material with a gas cluster ion beam (4a); and by evaporating/vaporizing a carbon film forming material containing a carbonaceous material containing substantially no hydrogen, and a boron material, allowing the evaporated/vaporized material to adhere to the surface of the intermediate layer film, and irradiating the carbon film forming material with a gas cluster ion beam (4a).Type: ApplicationFiled: November 28, 2011Publication date: February 5, 2015Applicant: NOMURA PLATING CO., LTD.Inventors: Teruyuki Kitagawa, Shuhei Nomura
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Patent number: 8517795Abstract: A surface-treating process and a forming process in which an inner surface of a vacuum member is mechanically polished in the presence of a liquid medium including no hydrogen atom.Type: GrantFiled: October 31, 2003Date of Patent: August 27, 2013Assignee: Nomura Plating Co., Ltd.Inventors: Kenji Saito, Tamao Higuchi
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Patent number: 8470155Abstract: In order to produce industrially advantageously an electroformed copper/niobium composite piping material wherein an electroformed copper layer and a niobium thin piping material are strongly bonded to each other, the electroformed copper/niobium composite piping material can be produced by coating any one or each of the outer peripheral surface and the inner peripheral surface of a niobium thin piping material with a nickel thin film, coating the surface of the nickel thin film with copper by electroforming, and subsequently annealing the resultant.Type: GrantFiled: May 29, 2006Date of Patent: June 25, 2013Assignees: High Energy Accelerator Research Organization, Nomura Plating Co., Ltd.Inventors: Kenji Saito, Tokumi Ikeda, Tamao Higuchi
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Patent number: 7909232Abstract: A mold welded with a dissimilar metal member manufactured by pressingly bringing the dissimilar metal member into contact with a mold formed of copper or a copper alloy in a stationary state while rotating the dissimilar metal member at a high speed, stopping the dissimilar metal member, and providing a forced pressure larger than the pressure in the first step to the mold. The present mold solves the problems of efficient cooling and attachment of back frame. Also, a variety of problems including cutting processing loss of copper or copper alloy plate, long processing times, heat distortion and heat deterioration of copper plates, etc, can be solved. Further, welding position precision and welding strength of stud bolts can be improved. Finally, the invention concerns a mold welded with a dissimilar metal member where the mold is manufactured by the first step shown above.Type: GrantFiled: February 25, 2009Date of Patent: March 22, 2011Assignee: Nomura Plating Co., Ltd.Inventors: Masahiro Nitta, Masayuki Mito, Ryoichi Ikeo, Takeshi Shinoda
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Patent number: 7896061Abstract: The objective of the present invention is to provide a product that is superior in barrier properties (for example, zinc erosion resistance and anti-adhesive property), abrasion resistant property, surface hardening property, thermal stability and life-time prolonging property. The product, which is made in direct contact with molten metal containing zinc in a molten state, is characterized by including an iron-tungsten alloy coating that is applied to a part or the whole of the surface of the product that comes directly in contact with the molten metal.Type: GrantFiled: February 1, 2006Date of Patent: March 1, 2011Assignees: Nomura Plating Co., Ltd., Osaka Prefectural GovernmentInventors: Keiji Nakai, Tokumi Ikeda, Takahiro Hamada, Tsutomu Morikawa, Takashi Nishimura, Takuo Nakade
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Patent number: 6354358Abstract: To provide a novel casting mold for use in continuous casting, which has long life and excellent heat resistance, yet capable of completely preventing corrosion, which frequently occurs on the lower portion of the casting mold. A continuous casting mold for steel made from copper or a copper alloy, wherein said casting mold comprises a plane in contact with molten steel partly or wholly covered with a tungsten alloy plating containing either or both of nickel and cobalt, and said plating containing tungsten carbide forming a solid solution therewith. To produce the casting mold above, there is used a plating solution containing either or both of a nickel salt and a cobalt salt and a tungstate, together with at least one selected from an oxycarboxylic acid and salts thereof, and at least one type of an organic compound and salts thereof having two or less of carbon atoms within the molecule, provided that its oxidation decomposition potential is lower than that of the oxycarboxylic acid or a salt thereof.Type: GrantFiled: November 22, 2000Date of Patent: March 12, 2002Assignee: Nomura Plating Co., Ltd.Inventor: Kohei Ishida