Abstract: In one embodiment, an opto-electronic assembly includes a housing having a cavity and an opto-electronic module disposed at least partially in the cavity of the housing. The housing is configured to support an electrical connection at a first end of the housing and support an optical connection at a second end of the housing. The opto-electronic module includes an opto-electronic transceiver, an electrical interface to provide an electrical connection to the opto-electronic module via the first end of the housing, a ferrule, and a lens, wherein the ferrule and the lens are to provide an optical connection to the opto-electronic module via the second end of the housing. The housing, the opto-electronic module, the opto-electronic transceiver, the electrical interface, and the ferrule have a magnetic permeability that is less than 1.0 B/H, where B is magnetic flux density and H is magnetic flux.

Abstract: A diagnostic monitoring device contains a diagnostic monitor circuit configured to monitor analog diagnostic monitoring information, and configured to convert the analog diagnostic monitoring information to digital diagnostic monitoring information, the diagnostic monitor circuit comprising a first clock or a first oscillator. The diagnostic monitoring device further contains a microcontroller comprising a register map, wherein the microcontroller is configured to receive the digital diagnostic monitoring information, store the digital diagnostic monitoring information in the register map, and provide a clock disable command to the diagnostic monitor circuit. The microcontroller further comprises a communications link for communicating with an external system external to the diagnostic monitoring device.

Abstract: A diagnostic monitoring device contains a diagnostic monitor circuit configured to monitor analog diagnostic monitoring information, and configured to convert the analog diagnostic monitoring information to digital diagnostic monitoring information, the diagnostic monitor circuit comprising a first clock or a first oscillator. The diagnostic monitoring device further contains a microcontroller comprising a register map, wherein the microcontroller is configured to receive the digital diagnostic monitoring information, store the digital diagnostic monitoring information in the register map, and provide a clock disable command to the diagnostic monitor circuit. The microcontroller further comprises a communications link for communicating with an external system external to the diagnostic monitoring device.

Abstract: An MRI coil testing system includes a frequency response monitoring subsystem and a temperature monitoring subsystem. The frequency response monitoring subsystem includes an embedded receiver probe configured to measure each individual coil's resonant frequency and nng-up/ring-down time, and a processor configured to output an alert if the resonant frequency or ring-up/ring-down time exceeds or violates respective thresholds. The temperature monitoring subsystem includes an embedded temperature probe configured to monitor the temperature of individual coils and the temperature of a magnetic resonance/radio frequency connector, and a processor configured to output an alert if either temperature exceeds a threshold.

Abstract: A diagnostic monitoring device contains a diagnostic monitor circuit configured to monitor analog diagnostic monitoring information, and configured to convert the analog diagnostic monitoring information to digital diagnostic monitoring information, the diagnostic monitor circuit comprising a first clock or a first oscillator. The diagnostic monitoring device further contains a microcontroller comprising a register map, wherein the microcontroller is configured to receive the digital diagnostic monitoring information, store the digital diagnostic monitoring information in the register map, and provide a clock disable command to the diagnostic monitor circuit. The microcontroller further comprises a communications link for communicating with an external system external to the diagnostic monitoring device.

Abstract: An optical connector including: a plug housing having a pin cavity; a pin disposed at least partially in the pin cavity of the plug housing, the pin comprising at least a pin sleeve, said pin sleeve at least partially containing a pin ferrule and a pin lens; a receptacle housing having a socket cavity; a socket disposed at least partially in the socket cavity, the socket comprising at least a socket sleeve, the socket sleeve at least partially containing a socket ferrule and a socket lens; and an alignment sleeve removably couplable between said pin and socket, wherein a pin front portion of said pin sleeve and a socket front portion of said socket sleeve are disposable in said alignment sleeve, wherein the plug housing, the pin, the pin sleeve, the pin ferrule, the receptacle housing, the socket, the socket sleeve, the socket ferrule, and the alignment sleeve: (i) magnetic permeability that is less than 1.

Abstract: An optical connector including: a plug housing having a pin cavity; a pin disposed at least partially in the pin cavity of the plug housing, the pin comprising at least a pin sleeve; a receptacle housing having a socket cavity; a socket disposed at least partially in the socket cavity, the socket comprising at least a socket sleeve; and an alignment sleeve between said pin and socket, wherein the plug housing, the pin, the pin sleeve, the pin ferrule, the receptacle housing, the socket, the socket sleeve, the socket ferrule, and the alignment sleeve: (i) magnetic permeability that is less than 1.0 B/H, where B is magnetic flux density and H is magnetic flux, and (ii) are configured to perform at least 100,000 mating cycles.

Abstract: In one embodiment, an opto-electronic assembly includes a housing having a cavity and an opto-electronic module disposed at least partially in the cavity of the housing. The housing is configured to support an electrical connection at a first end of the housing and support an optical connection at a second end of the housing. The opto-electronic module includes an opto-electronic transceiver, an electrical interface to provide an electrical connection to the opto-electronic module via the first end of the housing, a ferrule, and a lens, wherein the ferrule and the lens are to provide an optical connection to the opto-electronic module via the second end of the housing. The housing, the opto-electronic module, the opto-electronic transceiver, the electrical interface, and the ferrule have a magnetic permeability that is less than 1.0 B/H, where B is magnetic flux density and H is magnetic flux.

Abstract: A flexible printed circuit board comprises a conducting layer that includes a first signal line, a first ground plane and a second ground plane. A first shielding via extends from a third ground plane to a fourth ground plane and extends through the first ground plane to electrically connect the first ground plane, the third ground plane and the fourth ground plane. A second shielding via extends from the third ground plane to the fourth ground plane. The first ground plane, the second ground plane, the third ground plane, the fourth ground plane, the first shielding via and the second shielding via, together, circumferentially surround the first signal line to minimize electromagnetic interference with the first signal line.

Abstract: An optical connector including: a plug housing having a pin cavity; a pin disposed at least partially in the pin cavity of the plug housing, the pin comprising at least a pin sleeve; a receptacle housing having a socket cavity; a socket disposed at least partially in the socket cavity, the socket comprising at least a socket sleeve; and an alignment sleeve between said pin and socket, wherein the plug housing, the pin, the pin sleeve, the pin ferrule, the receptacle housing, the socket, the socket sleeve, the socket ferrule, and the alignment sleeve: (i) magnetic permeability that is less than 1.0 B/H, where B is magnetic flux density and H is magnetic flux, and (ii) are configured to perform at least 100,000 mating cycles.

Abstract: A flexible printed circuit board comprises a conducting layer that includes a first signal line, a first ground plane and a second ground plane. A first shielding via extends from a third ground plane to a fourth ground plane and extends through the first ground plane to electrically connect the first ground plane, the third ground plane and the fourth ground plane. A second shielding via extends from the third ground plane to the fourth ground plane. The first ground plane, the second ground plane, the third ground plane, the fourth ground plane, the first shielding via and the second shielding via, together, circumferentially surround the first signal line to minimize electromagnetic interference with the first signal line.

Abstract: A flexible printed circuit board comprises a conducting layer that includes a first signal line, a first ground plane and a second ground plane. A first shielding via extends from a third ground plane to a fourth ground plane and extends through the first ground plane to electrically connect the first ground plane, the third ground plane and the fourth ground plane. A second shielding via extends from the third ground plane to the fourth ground plane. The first ground plane, the second ground plane, the third ground plane, the fourth ground plane, the first shielding via and the second shielding via, together, circumferentially surround the first signal line to minimize electromagnetic interference with the first signal line.