Abstract: A solder-bearing lead for attachment to the surface of a substrate, wherein a discrete mass of solder is mechanically held firmly by the lead in a position permitting close proximity to the substrate surface to connect the lead to the substrate with an electrical and mechanical bond upon melting of the solder, the lead body having a pair of fingers partially encircling the solder mass with a gap between the fingers providing an unobstructed flow for the melted solder to the substrate. The lead may also be used to interconnect a first substrate to a second substrate, forming a bond between conductive areas on both substrates.

Abstract: A connector is disclosed which includes an insulating block having a plurality of channels therein which are substantially sized to accept terminal pins or posts of a mating component placed therein. A plurality of slots are located adjacent to the channels and respectively in communication therewith. Each channel includes a stop at the end thereof for engagement with a pin disposed therein, with the channel including a socket disposed at the bottom thereof. A plurality of contacts are placed respectively within the slots of the connector blocks with each contact having a terminal section which is sized to engage a through hole in a printed circuit board or the like, the terminal section extending from a mounting section which includes a pair of legs therein for resiliently mating with the socket of the block.