Abstract: We disclose a fabrication method for integrating passive devices such as capacitors, resistors and circulators into ceramic packages for electronic systems. The method utilizes a glass or glass/ceramic as a bonding agent which is incorporated as one of the layers in the multilayer package. The integration of such passive devices eliminates the tedious mounting of these devices on the package, permitting a smaller, more reliable, less expensive and lighter weight product. This method allows the integration of passive devices having firing temperatures far different from that of the ceramic package itself, permitting combinations of materials that cannot be densified, or cofired together.