Abstract: The invention relates to a surface machining device comprising a substrate support for receiving a substrate to be machined, a machining unit which can be moved relative to the substrate support along a first and a second movement axis, a position detecting unit for ascertaining the orientation of the substrate, and a control unit for controlling the movement of the machining unit dependent on the orientation of the substrate on the substrate support. The aim of the invention is to provide a surface machining device which can be produced in a compact manner and which allows a precise machining of the surface of the substrate to be machined in an inexpensive manner regardless of the position of the substrate on the substrate support. This is achieved in that the machining unit can be pivoted relative to the substrate support, in particular about a height axis which extends perpendicularly to the plane formed by the first and second movement axis.

Abstract: The invention relates to a surface machining device comprising a substrate support for receiving a substrate to be machined, a machining unit which can be moved relative to the substrate support along a first and a second movement axis, a position detecting unit for ascertaining the orientation of the substrate, and a control unit for controlling the movement of the machining unit dependent on the orientation of the substrate on the substrate support. The aim of the invention is to provide a surface machining device which can be produced in a compact manner and which allows a precise machining of the surface of the substrate to be machined in an inexpensive manner regardless of the position of the substrate on the substrate support. This is achieved in that the machining unit can be pivoted relative to the substrate support, in particular about a height axis which extends perpendicularly to the plane formed by the first and second movement axis.