Abstract: System and devices for monitoring and controlling the processing of a microelectronic substrate are disclosed. An aspect of the device comprises one or more clusters having sealed doors. Each of the sealed doors comprise a wet parts cabinet on a front side which is divided into a plurality of clusters and occupy one or more of chemical workstations which execute analytical applications. The sealed doors comprise an electrical cabinet on a back side for controlling the operation of the workstations. The sealed doors are configured to maintain a negative pressure in the wet parts cabinet and an overpressure in the electrical cabinet. The device also comprises a chemical cabinet for storing and providing the chemicals required for analytical applications running through the workstations. An interface of the device provides connectivity with a computing device for monitoring and controlling the analytical applications.

Abstract: Electrochemical analysis method and system for monitoring and controlling the quality of electrochemical deposition and/or plating processes. The method uses a fingerprinting analysis method of an output signal to indicate whether the chemistry and/or process is operating in the normally expected range and utilizes one or more substrates as working electrode(s) and a) whereby the potential between the one or more working electrodes and one or more reference electrodes is analyzed to provide an output signal fingerprint which is represented as potential difference as a function of time or b) the input power of a process power supply to provide input energy in the form of current and/or potential between the working electrode(s) and a counter-electrode whereby the method utilizes the potential between the one or more working electrode(s) and at least one of: one or more reference electrodes; or one or more counter-electrodes; to provide an output signal fingerprint.