Abstract: A structure of a light emitting diode (LED) lamp and a method for fabricating the same are provided. In the structure of the LED lamp, LEDs are designed to approach an inner surface of a lampshade more closely, so that the LED lamp has high brightness and high light-utilization efficiency. The above-mentioned structure and method facilitate the mass-production of the LED lamp.

Abstract: A structure of a light emitting diode (LED) lamp and a method for fabricating the same are provided. In the structure of the LED lamp, LEDs are designed to approach an inner surface of a lampshade more closely, so that the LED lamp has high brightness and high light-use efficiency. The method for fabricating the LED lamp includes the following steps. First, a holder is provided and at least one flexible LED light bar is assembled on the holder. The flexible LED light bar is then forced to approach the holder, and the flexible LED light bar as well as the holder are inserted into the lampshade. After the flexible LED light bar and the holder are inserted into the lampshade, the flexible LED light bar is bent outward to approach the inner surface of the lampshade. After that, the holder and the lampshade are assembled on a socket.

Abstract: A light emitting diode (LED) package is provided. The LED package includes a carrier, a package housing, a strength enhancement structure, an ESD protector and an LED chip. The carrier has a first surface and a second surface. The carrier includes a first electrode and a second electrode, wherein a gap is between the first electrode and the second electrode. The package housing is disposed on the carrier and has a first aperture and a second aperture. The first surface is exposed by the first aperture while the second surface is exposed by the second aperture. The strength enhancement structure is disposed at the gap. The ESD protector is disposed on the carrier and located within the second aperture. The LED chip is disposed on the carrier and located within the first aperture, wherein the ESD protector and the LED chip is electrically connected to the carrier.

Abstract: A fabrication method of a side-view LED package is provided. A chip carrier is provided. An opaque housing is bonded with the chip carrier. An LED chip electrically connects the chip carrier by performing a chip-bonding process and the opaque housing has a cavity for accommodating the LED chip. A transparent encapsulant is disposed in the cavity wherein the transparent encapsulant has a side-view light output surface uncovered by the opaque housing and light emitted from the LED chip is output via the side-view light output surface. A portion of the opaque housing and a portion of the transparent encapsulant are removed for reducing an overall thickness of the opaque housing such that a top surface of the transparent encapsulant is uncovered by the opaque housing beside the side-view light output surface. An opaque protective layer is formed on the top surface of the transparent encapsulant and the opaque housing.

Abstract: A Light Emitting Diode (LED) package including a carrier, a package housing, an LED chip, and an electrostatic discharge protector (ESD protector) is provided. The package housing encapsulates a part of the carrier so as to provide a chip-accommodating space on the carrier. The LED chip disposed on the carrier and located in the chip-accommodating space is electrically connected to the carrier. The ESD protector disposed on the carrier and encapsulated by the package housing is electrically connected to the carrier. The LED package has excellent light-emitting intensity, since the light emitted from the LED chip is not absorbed by the ESD protector encapsulated by the package housing. Additionally, a fabricating method of the LED package is also provided.