Patents Assigned to NovaSensor, Inc.
  • Patent number: 6559379
    Abstract: A three piece housing, designed to house semiconductor chips is molded using a polymer material. The chip sits on a metal base. Electrical leads pass through a molded housing to provide electrical contact between the semiconductor chip and external circuitry.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: May 6, 2003
    Assignee: NovaSensor, Inc.
    Inventors: Dinesh Solanki, Janusz Bryzek