Abstract: A process chamber measurement wafer for location inside a process chamber and measuring environmental conditions within the process chamber during a process run. The process chamber measurement wafer including a releasable dummy wafer to protect the instrumented portion of the process chamber measurement wafer from process material deposited during the process run.

Abstract: A coating for protecting a base material, such as a process chamber component, from an excess material film resulting from operation of a process chamber. The coating including a sheet for receiving the excess material deposited during the operation. In some aspects the sheet may be structured to provide at least one of stress relief and defect prevention in the deposited excess material. The sheet structure may include at least one of folds, ribs, and bi-facial curves in the sheet. In an aspect, the sheet may be patterned to provide improved adhesion of the deposited excess material. A plurality of joints for securing the at least one sheet at joint locations to the base material. In some aspects, a method and system are provided for protecting process chamber components.

Abstract: A removable coating for protecting process chamber components from excess material resulting from operation of a process chamber. The removable coating including a sheet. A bonding surface of the sheet to be releasably bonded to a process chamber component to be protected. A deposition surface of the coating selected to receive and retain the excess material. In an aspect, the coating may further include a deposition layer bonded to a sheet surface in opposition to the bonding surface. The deposition layer providing the deposition surface. In some aspects the deposition surface may be provided of a different material from the process chamber component. In some aspects, and method and system are provided for protecting process chamber components.