Abstract: The present invention relates to a surface acoustic wave filter in which a plurality of pairs of comb electrode patterns are formed on an upper surface of a chip substrate made of a piezoelectric material. The surface acoustic wave filter includes a high-resistance pattern formed to surround a peripheral portion of the chip substrate on an upper surface side thereof, and a plurality of patterns formed to connect the high-resistance pattern to the respective comb electrode patterns.

Abstract: A GND terminal 74 extends into a package 7, and the inwardly extending portion has a laterally extending portion (lateral portion) and a longitudinally extending portion (longitudinal portion). The lateral and longitudinal portions of the GND terminal 74 form an L-shaped metal portion 80 extending in a recess 78 of the package 7. When accommodating an SAW filter 100 in the package 7, the SAW package 100 is set in the recess 78 of the package 7 such that the back surface of the chip substrate is in contact with the L-shaped portion 80.

Abstract: A ladder SAW (surface acoustic wave) filter which includes a first SAW resonator disposed in a parallel arm and a second SAW resonator disposed in a series arm, has an inductor connected parallel to at least one of the first SAW resonator and the second SAW resonator. The frequency of a resonance point or an anti-resonance point of the at least one of the first SAW resonator and the second SAW resonator is adjusted by changing the inductance value of the inductor.

Abstract: A lead frame set includes a plurality of lead frames disposed in parallel and each lead frame includes a plurality of leads. Each of the leads includes an inner lead, an intermediate portion, and an outer lead, the intermediate portions are embedded in a resin molding base, and connect the inner leads at a higher level to the outer leads at a lower level, and at least one of widths and pitches of the inner leads and the outer leads are different values.

Abstract: An electronic part in which a surface acoustic wave device or the like is packaged by using a resin. The electronic part has a resin base in which a lead frame and a resin are integrally molded, a surface acoustic wave device or the like mounted on the top face of the resin base, a bonding wire for connecting a lead portion on the top face of the resin base and the electronic device, and a resin cap which is bonded on the resin base so as to form a space between the resin cap and the resin base. Apart of the lead is bent along the surface of the plastic package. It is also possible to dispose the surface acoustic wave device so that its electrode pattern formation surface faces the resin base without using the bonding wire.