Abstract: An assembly for performing an additive manufacturing process includes a first material feed for dispensing a first material, a second material feed for dispensing a second material, a material combiner chamber, a first entry channel fluidly connecting the first material feed and the material combiner chamber, and a second entry channel fluidly connecting the second material feed and the material combiner chamber. The assembly further includes a pen tip for dispensing a material in the additive manufacturing process, the material comprising the first material and the second material, a valve having a rod, a first seal between the material combiner and the pen tip, and a first actuator for moving the rod back and forth along a longitudinal axis to open and close the first seal.

Abstract: An apparatus for use in 3D fabrication includes a heat sink, a melt tube extending through the heat sink, the melt tube having a first end and an opposite second end and adapted for melting filament or other material as the material is conveyed from the first end to the second end, a pen tip having an opening therein for ejecting melted material, the pen tip at the second end of the melt tube, and a pen tip holder for securely holding the pen tip during printing, the pen tip holder having a heater element associated therewith.

Abstract: A method of building a three dimensional (3D) structure includes micro-dispensing a layer comprising a material using a syringe-based micro-dispensing tool, curing the layer, and repeating the steps of micro-dispensing and curing a plurality of times in order to build the three-dimensional structure. The material may be loaded with nano to micron sized particles, tubes, or strings.

Abstract: A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.

Abstract: A method of building a three dimensional (3D) structure includes micro-dispensing a layer comprising a material using a syringe-based micro-dispensing tool, curing the layer, and repeating the steps of micro-dispensing and curing a plurality of times in order to build the three-dimensional structure. The material may be loaded with nano to micron sized particles, tubes, or strings.

Abstract: A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.

Abstract: A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.

Abstract: A method for depositing a material on a substrate includes providing an apparatus with at least one material dispenser. The method further includes positioning the pen tip at a predetermined writing gap where the predetermined writing gap is a distance of more than 75 micrometers above the substrate. The method also provides for controlling velocity of the flow of material through the outlet and dispense speed based on dispensed line height and dispensed line width parameters. An apparatus for depositing a material on a substrate is also provided which may have one or more mechanical vibrators, a pen tip with a hydrophobic surface, or multiple nozzles and pen tips on a single pump.