Abstract: A semiconductor package includes a magnetic layer including an inner portion having a predetermined area and an outer portion disposed outward of the inner portion, a lower polymer layer disposed below the magnetic layer, and a dicing surface formed by ends of the magnetic layer and the lower polymer layer and extending along a stacked direction of the magnetic layer and the lower polymer layer. At least a part of the outer portion of the magnetic layer includes an inclined surface inclined downward in the stacked direction, and has a thickness greater than a thickness of the inner portion in the stacked direction.
Type:
Grant
Filed:
April 20, 2021
Date of Patent:
December 13, 2022
Assignee:
Ntrium Inc.
Inventors:
Se Young Jeong, Kisu Joo, Kyu Jae Lee, Seungjae Lee
Abstract: A semiconductor package includes a magnetic layer including an inner portion having a predetermined area and an outer portion disposed outward of the inner portion, a lower polymer layer disposed below the magnetic layer, and a dicing surface formed by ends of the magnetic layer and the lower polymer layer and extending along a stacked direction of the magnetic layer and the lower polymer layer. At least a part of the outer portion of the magnetic layer includes an inclined surface inclined downward in the stacked direction, and has a thickness greater than a thickness of the inner portion in the stacked direction.
Type:
Application
Filed:
April 20, 2021
Publication date:
October 21, 2021
Applicant:
Ntrium Inc.
Inventors:
Se Young JEONG, Kisu JOO, Kyu Jae LEE, Seungjae LEE
Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.
Type:
Grant
Filed:
April 11, 2018
Date of Patent:
November 24, 2020
Assignee:
NTRIUM INC.
Inventors:
Se Young Jeong, Ki Su Joo, Ju Young Lee, Jeong Woo Hwang, Jin Ho Yoon
Abstract: Provided is an electronic device including: an electronic component; and an electromagnetic interference shielding layer formed on at least a portion of the electronic component. The electromagnetic interference shielding layer includes: magnetic particles for electromagnetic wave absorption, each of the magnetic particles having a conductive film on a surface of the magnetic particle; and a conductive portion where conductive metal particles for electromagnetic shielding are sintered and formed on the conductive film of the magnetic particles.
Type:
Grant
Filed:
December 6, 2018
Date of Patent:
January 21, 2020
Assignee:
NTRIUM INC.
Inventors:
Se Young Jung, Jung Woo Hwang, Yoon Hyun Kim, Ki Su Joo, Kyu Jae Lee
Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.
Type:
Grant
Filed:
November 29, 2016
Date of Patent:
May 15, 2018
Assignee:
NTRIUM INC.
Inventors:
Se Young Jeong, Ki Su Joo, Ju Young Lee, Jeong Woo Hwang, Jin Ho Yoon