Abstract: A semiconductor chip test device may include: a guide plate having a seating groove formed at the bottom thereof; a substrate coupled to the bottom of the guide plate, and having an upper semiconductor chip mounted on the top surface thereof such that the upper semiconductor chip is positioned in the seating groove; an upper socket having upper pogo pins coupled to the bottom of the guide plate in a state where the upper pogo pins are in contact with bottom patterns of the substrate, and having lower pogo pins formed on the bottom surface thereof, wherein the upper pogo pins protrude upward, and the lower pogo pins protrude downward; and a lower socket having a lower semiconductor chip seated on the top surface thereof, the lower semiconductor chip being in contact with the lower pogo pins.

Abstract: A probe for inspecting electronic components, and more particularly, to a probe for inspecting electronic components, which connects a target electronic component to an inspection apparatus to inspect defects of the target electronic component. The probe for inspecting electronic components includes: a cylinder body having a cylindrical shape; a piston body reciprocating between an inside and an outside of the cylinder body; a spring surrounding an outer circumference of the cylinder body and the piston body, and forcing a part of the piston body to resiliently move out of the cylinder body when inserted into the cylinder body; a probing unit extending from the cylinder body to be brought into contact with a target electronic component to be inspected as to flow of electric current therethrough; and a contact unit extending from the piston body to be connected to an inspection apparatus for inspecting the target electronic component.

Abstract: A probe for inspecting electronic components, and more particularly, to a probe for inspecting electronic components, which connects a target electronic component to an inspection apparatus to inspect defects of the target electronic component. The probe for inspecting electronic components includes: a cylinder body having a cylindrical shape; a piston body reciprocating between an inside and an outside of the cylinder body; a spring surrounding an outer circumference of the cylinder body and the piston body, and forcing a part of the piston body to resiliently move out of the cylinder body when inserted into the cylinder body; a probing unit extending from the cylinder body to be brought into contact with a target electronic component to be inspected as to flow of electric current therethrough; and a contact unit extending from the piston body to be connected to an inspection apparatus for inspecting the target electronic component.