Abstract: A capacitor includes a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal on an exposed side, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal on an exposed side, and an insulating sheet disposed between the first busbar and the second busbar to insulate an overlap region; a plastic case having a 3D space formed by four sides and a bottom to accommodate the capacitor module and having an open top; a metallic external wall is formed outside one side of the four sides or the bottom of the plastic case; and a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case.

Abstract: The present disclosure relates to a metal case capacitor that includes: a capacitor module (10) including a capacitor device, a first busbar (1) electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal (1a) on an exposed side, a second busbar (2) electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal (2a) on an exposed side, and an insulating sheet disposed between the first busbar (1) and the second busbar (2); a metallic external case (20) having a space; a plastic insulating member positioned between the capacitor module (10) and the metallic external case (20) and insulating the capacitor module (10) and the metallic external case (20) from each other; and a filler permeating in a gel or liquid state into a space between the capacitor module (10) and the metallic external case (20).

Abstract: The present disclosure relates to a case molding including: a plastic case having an accommodation chamber formed by four sides and a bottom to accommodate the capacitor module, and having an open side on the top for filling a molding agent; a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor, and an insulating sheet disposed between the first busbar and the second busbar; a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case, and then hardened therein; and a horizontal plate part positioned over the capacitor module and the filler, and has a horizontal plate integrated thereto with the bottom pressing the filler.

Abstract: A capacitor housing case with output terminal withdrawn forward comprises: a rear plate for forming the placement space which is divided by division portion being projected longitudinally; a top plate which is vertically formed forward from a top of the rear plate; a bottom plate which is formed parallel to the top plate forward from a bottom of the rear plate; a side plate for forming the placement space having a front opening by coupling to both sides of the rear plate, a top plate and a bottom plate; and at least two fixed mount, which is exposed outside parallel to the rear plate, for having a fixation groove penetrating up and down; wherein a capacitor output terminal is extended through the front opening, and epoxy is inserted through the front opening, and the capacitor elements and the first, the second busbar-formed portion are epoxy molded.

Abstract: A bus-bar for assembling a capacitor device is disclosed, which is capable of improving the environment of a soldering operation for the bus-bar being soldered to a capacitor device, reducing the inferior rate of the capacitor device while improving the quality of the capacitor device, and reducing the weight of the capacitor module, in soldering the bus-bar to capacitor devices. The lead frame attached to polar plates by soldering is formed thinner than the other parts of the bus-bar, and opening parts having an oval or polygonal shape are formed on a surface of the bus-bar so that two adjoining capacitor devices can be exposed. The lead frame is formed in the opening in order for soldering with the polar plates of the capacitor device.

Abstract: There is provided a deposited film for a film capacitor, which comprises: a thermally sprayed metal contact part formed at one end of a dielectric in a width direction of the dielectric, and a margin part having no deposited metal formed at the other end of the dielectric in the width direction of the dielectric; a split electrode in a rectangular shape formed by forming a T-shaped window margin, from the margin part to a predetermined position within a width range of the deposit film, in the width direction of the deposited film; and a fuse part formed between the split electrodes in the width direction of the deposited film, wherein adjacent fuse parts in the length direction of the deposited film are formed in a stepped layout in the width direction of the deposited film.

Abstract: There is provided a method of connecting busbars for a capacitor and a product manufactured by the same method, whereby the inductance of the capacitor is decreased and thus the amount of heat generated in the capacitor is decreased to improve the temperature characteristics and electrical characteristics of the capacitor and the reliability of the quality of the capacitor, to consistently improve the insulation between the busbars having different polarity, and to maintain the insulation between the busbars in severe environments. The method of connecting busbars for a capacitor is characterized by coating at least parts of an N-pole busbar and a P-pole busbar, each of which has different polarity, with an insulating material; exposing parts of the N-pole and P-pole busbars outside an outer case so as to form a terminal to be connected to an other component; and connecting the N-pole busbar to the P-pole busbar in a manner that at least parts of the N-pole and P-pole is busbars overlap each other.

Abstract: Disclosed are a method for connecting a bus bar of a capacitor, improving temperature characteristics and reliability of the capacitor by reducing inductance and impedance such that heat generation is restrained during use of the capacitor, and a product fabricated by the same. A pair of bus bars are insulatedly connected to sprayed surfaces on both sides of a plurality of capacitor devices, in such a manner that lead frames arranged alternately on a first bus bar are connected in contact with the sprayed surfaces facing in a diagonal direction, of neighboring capacitor devices. Other lead frames arranged alternately on a second bus bar are connected to the sprayed surfaces facing in another diagonal direction across the above diagonal direction in an X-shape. Then, the pair of bus bars are assembled to be insulated from each other and overlapped at one side of the capacitor device.

Abstract: Disclosed are a method for connecting a bus bar of a capacitor, improving temperature characteristics and reliability of the capacitor by reducing inductance and impedance such that heat generation is restrained during use of the capacitor, and a product fabricated by the same. A pair of bus bars are insulatedly connected to sprayed surfaces on both sides of a plurality of capacitor devices, in such a manner that lead frames arranged alternately on a first bus bar are connected in contact with the sprayed surfaces facing in a diagonal direction, of neighboring capacitor devices. Other lead frames arranged alternately on a second bus bar are connected to the sprayed surfaces facing in another diagonal direction across the above diagonal direction in an X-shape. Then, the pair of bus bars are assembled to be insulated from each other and overlapped at one side of the capacitor device.

Abstract: A bus-bar for assembling a capacitor device is disclosed, which is capable of improving the environment of a soldering operation for the bus-bar being soldered to a capacitor device, reducing the inferior rate of the capacitor device while improving the quality of the capacitor device, and reducing the weight of the capacitor module, in soldering the bus-bar to capacitor devices. The lead frame attached to polar plates by soldering is formed thinner than the other parts of the bus-bar, and opening parts having an oval or polygonal shape are formed on a surface of the bus-bar so that two adjoining capacitor devices can be exposed. The lead frame is formed in the opening in order for soldering with the polar plates of the capacitor device.

Abstract: A metallized plastic film is formed by winding two sheets of film vapor-deposited with an electrode metal as one group and a film capacitor, comprising; three individual splittings of electrode metal by predetermined width and length and then adjoining of splitting parts. Accordingly, self-heating of the film capacitor can be restrained and a capacitance reduction rate caused by the operation of the fuse parts can be reduced.

Abstract: A metalized plastic film for a rolled film capacitor or a laminated film capacitor and a film capacitor are disclosed. The metalized plastic film having a plastic film and an electrode metal deposited on the plastic film and patterned for a film capacitor includes rectangular split electrodes extending from a margin region defined at one side of the plastic film as a region free of the deposited electrode metal toward an opposite side of the plastic film, to have a length corresponding to about one fourth to four fifth of a width of the plastic film, the split electrodes being continuously arranged at specified intervals in a longitudinal direction of the plastic film, fuse portions each formed in an associated one of the split electrodes between the margin region and an electrode metal contacting region of the associated split electrode.