Abstract: The present invention relates to a method of manufacturing printed circuit boards.The method of manufacturing printed circuit boards under the present invention is to provide holes on a metal plate, to attach a prepreg to the metal plate, and to fill the prepreg into the holes by heat-pressing the metal plate to which the prepreg is attached. Thereafter, lead wire holes are provided at the centers of prepreg filled the holes, and a resin plate having at least one circuit layer and through holes is glued to the metal plate. Alternately, a resin plate having at least one circuit layer and lead wire holes, or a resin plate having at least one circuit layer, through holes and lead wire holes are glued to the metal plate on the side where the prepreg is attached.

Abstract: The present invention relates to a printed circuit board and to a method of manufacturing the same. The printed circuit board has a reinforcing panel glued to the surface of a resin board. The resin board is provided with at least one circuit layer and through holes. The reinforcing panel contains a core in a plate form and is made of at least one curved board and a metal board glued at least to one side of the core. The reinforcing panel is provided with resin holes, the resin holes are filled with resin, and a lead wire hole is provided through the center of the filled-in resin. The center line of the through hole and that of the lead wire hole are almost identical. The manufacturing method provides a lead wire hole through the center of each resin filled hole in a reinforcing panel by a drilling device assisted by a hole position designating means.

Abstract: The present invention relates to a printed circuit board and to a method of manufacturing the same.The printed circuit board of the present invention consists of a metal board glued to a resin board which is provided with at least one circuit layer. The metal board is provided with holes which are filled with resin, and lead wire holes are provided at the centers of the resin filled holes. The resin board is provided with through holes. The center of the lead wire holes and the centers of the through holes are on identical lines.Further, the method of manufacturing a printed circuit board under the present invention is to provide resin holes on a metal board, filling the holes with resin, and providing lead wire holes at the centers of the resin filled holes. In this process, an identical hole position designating means is used for providing the resin holes and the lead wire holes. At least one circuit layer and through holes are to be provided on the resin board.