Abstract: A thin laminate passive electrical device, such as, a capacitor, and a method of fabricating a thin laminate passive electrical device are provided. The passive electrical device includes two conductors, for example, copper foil conductors, separated by a dielectric having a first layer of a first material having a softening point temperature greater than a first temperature and a first layer of a second material having a softening point temperature less than the first temperature. The first temperature may be at least 150 degrees C. or higher. By providing a first layer having a higher softening point material, shorting across the conductors, that can be promoted by the fabrication process, is prevented. Methods of fabricating passive electrical devices are also disclosed.
Type:
Grant
Filed:
January 12, 2009
Date of Patent:
October 21, 2014
Assignee:
Oak-Mitsui Technologies LLC
Inventors:
Pranabes K. Pramanik, Yuji Kageyama, Fujio Kuwako, Jin Hyun Hwang
Abstract: A thin laminate passive electrical device, such as, a capacitor, and a method of fabricating a thin laminate passive electrical device are provided. The passive electrical device includes two conductors, for example, copper foil conductors, separated by a dielectric having a first layer of a first material having a softening point temperature greater than a first temperature and a first layer of a second material having a softening point temperature less than the first temperature. The first temperature may be at least 150 degrees C. or higher. By providing a first layer having a higher softening point material, shorting across the conductors, that can be promoted by the fabrication process, is prevented. Methods of fabricating passive electrical devices are also disclosed.
Type:
Application
Filed:
January 12, 2009
Publication date:
July 15, 2010
Applicant:
OAK-MITSUI TECHNOLOGIES LLC
Inventors:
Pranabes K. PRAMANIK, Yuji KAGEYAMA, Fujio KUWAKO, Jin Hyun HWANG