Patents Assigned to Oakley Industries, Incorporated
  • Patent number: 5350098
    Abstract: A workpiece severing apparatus includes rotatable cutting and breaking assemblies that move about a fixedly held workpiece. At the same time a cutting edge of the cutting assembly is moving through the workpiece by cutting the workpiece along its entire periphery, rollers of the breaking assembly are applying a desired force to workpiece portions. Movement of the rollers relative to the workpiece is controlled so that tension is always applied to the workpiece in a way that facilitates cutting. The cutting assembly stops its cutting operation when a predetermined thickness of the workpiece remains. After this occurs, the two assemblies continue to rotate and the breaking assembly eventually causes a severed workpiece portion to be separated from a held workpiece portion.
    Type: Grant
    Filed: October 22, 1992
    Date of Patent: September 27, 1994
    Assignee: Oakley Industries, Incorporated
    Inventors: Gary A. Oakley, David Chrisp