Abstract: A substrate comprising at least a first and a second coating layer on one surface of the substrate is for nanoimprint lithography, the first coating layer has a positive resist and the second coating layer has a negative resist. A process in connection with nanoimprint lithography on the substrate impresses a pattern of nanometer size in a first stage into the second coating layer by a template, following which the first coating layer, in a second stage, is exposed to a chiefly isotropic developing method on surfaces thereof that have been exposed in connection with the first stage, a method for developing and material for the first and second coating layers being selected so that the first coating layer is developed more quickly than the second coating layer, so that an undercut profile is obtained in the coating layers.

Abstract: Method in connection with the production of a template, preferably for nanoimprint lithography, which template comprises a flat plate (1) of a first material and a three-dimensional structure (6, 8) of a second material, arranged on the plate, said second material introductory being applied on said plate, in the method, to form the structure. The second material is thereafter fixed to the plate the second material is thereafter fixed to the plate of the first material, by heat treatment (Q) at at least 100° C., for the production of the template. A template is produced by use of the method.

Abstract: A metal mold for use in a nano-imprinting process comprises a firmly adhering monomolecular non-sticking layer. The layer was obtained by subjecting the mold to a reaction with a fluoroalkyl compound having a mercapto group. As a result of said reaction, the layer comprises an organic sulfide of said metal.

Abstract: In etching, an etchant (4) for etching of a substrate (1) is applied in a given pattern. Before etching, a resist layer (2) is applied to the substrate (1) in said pattern to define at least one exposed portion (3) of the substrate (1). In order to minimize under etching, a passivating substance is arranged, before etching, on the substrate (1) to also define said pattern, i.e., at the periphery of the exposed portion (3). The passivating substance is such as to form, during etching, an etch-protecting compound at the periphery.

Abstract: An information recording apparatus comprises a vacuum chamber, an energy beam generator emitting an energy beam for recording information on a substrate in the vacuum chamber, a spindle motor rotating the substrate in the vacuum chamber, a movable holder disposed in the vacuum chamber for carrying the spindle motor, and a feed motor unit connected to the movable holder for linearly moving the substrate in a vacuum atmosphere within the vacuum chamber. The holder, the vacuum chamber, and the energy beam generator are fixed to a common plate-shaped base member. The feed motor unit is connected to the movable holder by means of a hollow rod, a flexible sleeve element being provided over the rod between the feed motor unit and the vacuum chamber wall.

Abstract: In a method of etching a substrate having a surface layer of conductive material, a circuit pattern is transferred to the surface layer in a central surface area portion of the substrate by electrochemical etching. To prevent excessive current densities from forming at the periphery of the central surface area portion during the etching step, a frame adapted to attract electrical field is provided adjacent to the central surface area portion. The frame can be part of a separate frame element which is placed on the substrate before the etching step, or be incorporated in a resist coating on the substrate. The frame can be transferred to the resist coating by any suitable means, for example by photolithographic exposure through a mask with a suitable frame pattern. Alternatively, the frame can be incorporated in a prefabricated substrate element, to which the circuit pattern is transferred in the etching step.