Abstract: A pattern structure of at least two different layer system elements disposed adjacent one beside the other upon a carrier substrate, at least one of said layer system elements comprises a layer of dielectric material, the layer of dielectric material residing upon a layer of a material that is resistant to activated oxygen or activated water and having a second surface facing toward the substrate. The dielectric layer of the one layer system element forms a disturbed region between the adjacent layer system elements, the dielectric layer having a thickness of d5 and wherein the disturbed region has a width of at most 10*d5.