Abstract: To mount a microcircuit module in a cavity in a card forming a support, resin is deposited on the bottom of the cavity and the module is fitted in such a way that the microcircuit is coated with resin. A compressible annular area formed in the cavity completely surrounds the microcircuit and the coating material. The annular area extends over a continuous peripheral area of the bottom of the cavity.
Type:
Grant
Filed:
May 4, 2000
Date of Patent:
February 4, 2003
Assignee:
Oberthur Card Systems SAS
Inventors:
Francoise Bouchez, Francois Launay, Pierre Loubly, Jacques Venambre