Abstract: The invention relates to optical instruments. There are provided a method for inspection of an analyzed surface and a scanning analyzer for inspection of defects on the surface. The method comprises the steps of rotating an object with the analyzed surface about a first center of rotation; forming a light spot on the analyzed surface; and sensing separately a light mirror-reflected and a light scattered from the analyzed surface at the incidence point of the light spot; and detecting surface defects by analyzing the produced signals. To implement the method, a surface scanning analyzer moves the light spot relative to the analyzed surface through an arc about a second center of rotation which lies outside the analyzed surface; and detects defects on the surface of wafers by measuring the magnitude of the scattered light. The reduced size and cost of the measurement device enables its integration into manufacturing equipment for inspection of semiconductor wafers in electronic industry.