Abstract: A method of magnetron sputtering, comprises rotating a magnet of a magnetron with an angular frequency ?, and, during sputtering of material from a source of the magnetron onto a substrate, periodically modulating a power level applied to the source with at least a component comprising a frequency f which is a harmonic of the angular frequency ? of rotation of the magnet other than the first harmonic.
Type:
Grant
Filed:
December 4, 2008
Date of Patent:
August 21, 2012
Assignee:
OC Oerlikon Blazers AG
Inventors:
Stanislav Kadlec, Frantisek Balon, Juergen Weichart, Bart Scholte van Mast
Abstract: A method for producing a disk shaped workpiece with a dielectric substrate includes treatment in a plasma process volume between two electrode faces bounding a high-frequency plasma discharge. One electrode face is of dielectric material and is at a high-frequency potential with a varying distribution along the face. The other electrode face is metallic. Reactive gas is introduced into the process volume through an aperture pattern. The dielectric substrate, before treatment, is at least regionally coated with a layer material to whose specific resistance applies: 10?5 ?cm??10?1 ?cm, and to the resulting surface resistance RS of the layer applies: 0<RS?104 ?. Subsequently, the coated substrate is positioned on the metallic electrode face and is etched or coated reactively under plasma enhancement in the plasma process volume.
Type:
Grant
Filed:
April 30, 2004
Date of Patent:
November 11, 2008
Assignee:
OC Oerlikon Blazers Ag
Inventors:
Arthur Buechel, Werner Wieland, Christoph Ellert, Laurent Sansonnens