Abstract: Disclosed is a method of bonding integrated circuit chips to lead frames where the leads are later soldered. A solution of an adhesive polyimide is used. The polyimide is the reaction product of an aromatic dianhydride and a mixture of an aromatic diamine and an aliphatic diamine.

Abstract: Disclosed is a method of dispersing a tacky additive in a solution of a polymer, particularly a polyolefin. A dispersion composition prepared by adding the additive to a slurry of a non-polar solvent and an insoluble, infusible, non-reactive dispersant is added to the polymer solution. This prevents the additive from sticking to the vessel walls and the impeller or agglomerating.

Abstract: Decomposition of perchloroethylene is prevented by the addition of a stabilizer system containing N-substituted cyclic alkyl amine, alcohol of 3-7 carbon atoms and olefin components. The stabilizer system is advantageous in that it does not contain any environmentally undersirable materials.

Abstract: A mixture of telomers prepared by reacting chlorotrifluoroethylene with 1,1,2-trichlorotrifluoroethane (CCl.sub.2 FCF.sub.2 Cl) is purified by reacting the telomer mixture with potassium hydroxide in the presence of a quarternery ammonium compound and, optionally, a glycol, separating and removing impurities from the telomer mixture, subsequently reacting the telomer with potassium permanganate in the presence of the quarternery ammonium compound in a solvent, and recovering a purified telomer mixture.If additional purity is required, the purified telomer mixture can be heated to a temperature of from about 150.degree. C. to about 250.degree. C. for at least 12 hours, and impurities formed during the thermal treatment are removed.The purified telomers of this invention find uses in applications requiring the use of non-flammable hydraulic fluids.