Abstract: A replacement for probe cards includes a full wafer contacter. A first surface of the full wafer contacter is brought into contact with, and the contacter is attached to, a wafer, thereby making electrical connection with at least a portion of the contact pads on each of a plurality of integrated circuits on the wafer. The full wafer contacter provides conductive pathways from the IC contact pads to a second surface of the full wafer contacter where a corresponding set of contact pads provide access to test systems and/or other devices. The contact pads on the second surface of the full wafer contacter are typically larger than the contact pads of the integrated circuits, and are typically spaced father apart from each other. The full wafer contacter is constructed to be suitable to provide access to the contact pads of the unsingulated integrated circuits during a wafer burn-in process.

Abstract: A conductor carrier provides, separately manufactured, conductive pathways, on a wafer level, which may be coupled to a wafer of fully fabricated integrated circuits. Such conductor carriers include an insulating body having two major surfaces with conductors disposed on each of those surfaces, and conductors disposed within the insulating body so as to provide signal continuity between various conductors on each of the two surfaces. An assembly can be formed by permanently or removably attaching the conductor carrier to the wafer. Conductor carriers may include an evacuation pathway suitable for removing air, or other gases, from between the conductor and the wafer so as to create a pressure differential that urges the conductor carrier into contact with the wafer. Conductor carriers may include a groove which is suitable for receiving a sealing ring; and may include a street map which is suitable for providing guidance to a wafer sawing operation.