Patents Assigned to Octavo Systems LLC
  • Substrate for system in package (SIP) devices
    Patent number: 10204890
    Abstract: Methods, systems, and devices for enabling the use of a special, generic, or standard substrate for similar system SIP assemblies are disclosed. The required customization, which is defined by a system's interconnecting scheme, is done during package assembly by creating appropriate connections using wire bonds on pads that are placed on the substrate and intentionally left open for purpose of customization. The wire bond links can be changed as required for a given system design.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: February 12, 2019
    Assignee: Octavo Systems LLC
    Inventors: Masood Murtuza, Gene Alan Frantz
  • EMI SHIELD FOR MOLDED PACKAGES
    Publication number: 20190027443
    Abstract: Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.
    Type: Application
    Filed: July 20, 2018
    Publication date: January 24, 2019
    Applicant: Octavo Systems LLC
    Inventors: Masood MURTUZA, Peter Robert Linder, Gene Alan Frantz
  • COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS
    Publication number: 20180321313
    Abstract: A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.
    Type: Application
    Filed: May 8, 2017
    Publication date: November 8, 2018
    Applicant: Octavo Systems LLC
    Inventors: Kevin Michael Troy, Peter Robert Linder, Masood Murtuza, Gene Alan Frantz
  • SYSTEM-IN-PACKAGE DEVICE BALL MAP AND LAYOUT OPTIMIZATION
    Publication number: 20180317323
    Abstract: Systems and methods for the design and use of a System-in-Package (SiP) device with a connection layout for minimizing a system Printed Circuit Board (PCB) using the SiP are provided.
    Type: Application
    Filed: May 1, 2018
    Publication date: November 1, 2018
    Applicant: Octavo Systems LLC
    Inventors: Erik James Welsh, Kevin Michael Troy
  • REDUCTION OF PASSIVE COMPONENTS IN SYSTEM-IN-PACKAGE DEVICES
    Publication number: 20180317316
    Abstract: Methods and systems for reducing the number of, and values of, passive components, such as capacitors, in System-in-Package devices below vendor recommendations for an active component are provided.
    Type: Application
    Filed: May 1, 2018
    Publication date: November 1, 2018
    Applicant: Octavo Systems LLC
    Inventors: Erik James Welsh, Peter Linder
  • IMPROVED SUBSTRATE FOR SYSTEM IN PACKAGE (SIP) DEVICES
    Publication number: 20170287885
    Abstract: Methods, systems, and devices for enabling the use of a special, generic, or standard substrate for similar system SIP assemblies are disclosed. The required customization, which is defined by a system's interconnecting scheme, is done during package assembly by creating appropriate connections using wire bonds on pads that are placed on the substrate and intentionally left open for purpose of customization. The wire bond links can be changed as required for a given system design.
    Type: Application
    Filed: August 13, 2015
    Publication date: October 5, 2017
    Applicant: Octavo Systems LLC
    Inventors: Masood MURTUZA, Gene Alan FRANTZ
  • SYSTEMS AND METHODS FOR MANUFACTURING ELECTRONIC DEVICES
    Publication number: 20170221871
    Abstract: Systems and processes for flexible and/or low volume product manufacture, including cost effective ways to manufacture low volume system level devices. In one aspect, this disclosure enables the manufacture of a plurality of System in Package (SiP) devices. In one aspect, the devices include one or more of an optical and electrical identifier, corresponding to substrates and/or product designs. The identifiers can be used in the assembly of the devices.
    Type: Application
    Filed: January 31, 2017
    Publication date: August 3, 2017
    Applicant: Octavo Systems LLC
    Inventors: Gregory Michael Sheridan, Gene Alan Frantz, Masood Murtuza, Shankar Jayaraman Panchavati