Abstract: The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to a first system of coordinates. The position and orientation of the substrate place on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates. The conversion of coordinates of the first or second system of coordinates into coordinates of motion of the pick-and-place system occurs by means of two fixed mapping functions and two changeable correction vectors. The correction vectors are readjusted on the occurrence of a predetermined event.

Abstract: A device for supplying a wire from a wire roll to a capillary of a wire bonder comprises a holder, driven by a motor, for a wire roll and a wire store. The wire store comprises a plurality of channels that can be loaded with compressed air and the exit apertures of which are located on a circular arc and span a predetermined angle range and which run in a substantially radial direction with respect to the center of the circular arc, in order that the wire runs substantially along a circular path within the predetermined angle range.

Abstract: A foil perforation needle for perforating a foil and detaching a die from the foil has a shaft, which passes at one end into a blade having a cutting edge. The cutting edge minimizes the strain per unit area occurring upon impact on the foil and, after the perforation of the foil, upon impact on the die.

Abstract: The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position of the semiconductor chip as well as measurement of the actual position of the substrate location in relation to a system of coordinates defined by the reference marks. Positional displacement of the individual components of the assembly machine caused by thermal influences can be compensated without perpetual calibration procedures having to be carried out.

Abstract: A wire bonder comprises a bonding head with a rocker which is arranged on the bonding head and is rotatable about a horizontal axis. The rocker comprises at least three bores into which a piezoelectric element each is inserted, which element is used either as a sensor or as a piezoelectric drive in order to move a horn which is fastened to a body relative to the rocker. The body is tightly screwed onto the rocker by means of at least three screws, with at least two screws being tightly screwed in a resilient way. The body is pressed against the piezoelectric elements. A membrane is preferably arranged between the rocker and the body, which membrane prevents that shearing forces can act upon the piezoelectric elements.

Abstract: A pick-up tool for gripping a die comprises a sleeve and a gripping member. The sleeve has a longitudinal bore extending in the longitudinal direction in which the gripping member is inserted. The gripping member is held in the sleeve displaceably in the longitudinal direction. A portion of the gripping member protrudes from the sleeve. The gripping member assumes a predetermined position relative to the sleeve at the absence of any external action of force on the portion of the gripping member protruding from the sleeve, in which the portion of the gripping member protruding from the sleeve is held in a play-free manner radially to the longitudinal direction. In the case of action of force in the longitudinal direction on the portion of the gripping member protruding from the sleeve, the gripping member can be inserted further into the sleeve and is then radially movably held in the longitudinal bore of the sleeve. The mass of the gripping member is not more than 1 gram.

Abstract: The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to a first system of coordinates. The position and orientation of the substrate place on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates. The conversion of coordinates of the first or second system of coordinates into coordinates of motion of the pick-and-place system occurs by means of two fixed mapping functions and two changeable correction vectors. The correction vectors are readjusted on the occurrence of a predetermined event.

Abstract: A semiconductor mounting apparatus contains a pick and place system having a bonding head, which has a first drive system and a second drive system for displacing the bonding head in a predetermined direction. The first drive system has a first pivot arm and a first stationary situated drive, which is used to pivot the pivot arm back-and-forth within a predefined pivot range. The second drive system is mounted on the pivot arm and comprises a stationary situated electric motor.

Abstract: A device for pressing on semiconductor chips situated on a substrate comprises a substrate support and a tool movable in relation to the substrate support in a predetermined movement direction, which has multiple pressing plungers mounted so that they are displaceable in the movement direction of the tool for pressing on the semiconductor chips. The tool has a pressure chamber to which compressed air may be applied. All pressing plungers are situated along a straight line. Each of the pressing plungers has a bar running perpendicularly to the movement direction of the tool and perpendicularly to the cited straight line on its end facing toward the pressure chamber. Pistons are situated in the area between the pressure chamber and the pressing plungers, which are displaceable in the movement direction of the tool. One side of the pistons is subjected to the pressure existing in the pressure chamber and the other side rests on one of the bars of the pressing plungers.

Abstract: A bond head for a wire bonding comprises a platform which is movable in a horizontal plane and on which a rocker is arranged which is rotatable about a first horizontal axis. An ultrasonic transducer which is rotatably held about a second horizontal axis is fastened to the rocker. A linear motor is arranged close to the first horizontal axis, with which the rotational position of the ultrasonic transducer is adjustable relative to the rocker. A sensor supplies an output signal from which the rotational position of the ultrasonic transducer can be derived. A controller regulates the position of the linear motor and thus rotational position of the ultrasonic transducer. The controller is also configured to supply a predetermined current to the linear motor in order to generate the required bonding force during the bonding.

Abstract: A wire clamp for a wire bonder comprises a first arm and a second arm, which is mounted on the first arm so that it is rotatable around a predetermined axis. The first arm and the second arm each have a clamping jaw on an end distal from the axis. The wire clamp also comprises a piezo bending element for opening and closing the wire clamp. One end of the piezo bending element is fastened to the second arm and an opposite end of the piezo bending element bears in a retainer fastened to the first arm.