Abstract: A method for manufacturing a thin-film solar cell includes providing a first conducting layer on a substrate that has an area at least 0.75 m2. The first conducting layer is located in a deposition portion of the area. An ultraviolet laser beam is applied through a lens to the first conducting layer. Portions of the first conducting layer are scribed form a trench through the layer. The lens focuses the beam and has a focal length at least 100 mm. The focused beam includes an effective portion effective for the scribing and an ineffective portion ineffective for the scribing. The substrate sags and the first conducting layer remains in the effective portion of the focused beam across the area during the step of applying. One or more active layers are provided on the first conducting layer. A second conducting layer is provided on the one or more active layers.

Abstract: A plasma reactor (1) for treating a substrate (40), comprises at least two electrodes (20, 30) arranged within the reactor (1) defining an internal process space (13) there between, whereas the two electrodes (20, 30) are located opposed to each other and parallel with respect to a first surface (20a) of the electrodes (20, 30). Further it comprises a gas inlet (11) and a gas outlet (12) for transporting gas in and out of the plasma reactor (1), a radiofrequency generator (21) connected to at least one of the electrodes (20, 30).

Abstract: The present invention provides an improved thin film solar cell, wherein at least one additional resistive transparent conductive oxide (TCO) layer is incorporated into the solar cell. The additional resistive TCO electrically separates the conductive TCO layers acting as electrodes of such a cell and thus decreases or prevents performance losses. Furthermore, methods for the production of such solar cells are disclosed.

Abstract: A gate valve for a vacuum chamber comprises two carriers (5a) each connected to a frame structure providing an essentially plane front by two parallel links (6) and to an actuating rod (12a) by parallel levers (14). Upward motion of the actuating rods (12a) by a piston (17) causes, via the levers (14), upward motion of the carriers (5a) which is transformed into a circular motion by the links (6) where the carriers (5a) at the same time approach the front while remaining parallel to it, moving sealing plates (9) which are fixed to the carriers (5a) to an active position where they press against the front and seal openings (3) therein. Retraction of the piston (17) effects an inverse motion, whereby the sealing plates (9) are completely removed from the openings (3) and the latter made easily accessible.

Abstract: A large surface substrate (5, 5a) is Rf vacuum plasma treated with the help of an electrode arrangement (9) consisting of an even number of electrode strips (9a, 9b). At least one of the strips is Rf supplied at least two distinct loci (P1, P2) along the central axis (A) of the addressed strip (9a).

Abstract: A magnetron sputtering source includes a plurality of electrodes and a switching circuit. The switching circuit sequentially connects each of the plurality of electrodes to a ground reference, making it anodic, while connecting the remaining of the plurality of electrodes as cathodes. A method of operating the magnetron sputtering source includes steps of: providing a plurality of target arrangements; causing each of the plurality of target arrangements to act as a cathode; and sequentially causing each of the plurality of cathodes to temporarily act as an anode.

Abstract: The invention relates to a lifting and supporting device for handling and positioning particularly large-surface elements in the shape of panels, especially in plasma processing installations. Said lifting and supporting device comprises a particularly metallic base plate, on which a plurality of particularly dielectric pins are arranged. Said pins may be set in pin holes especially provided in the base plate. Said panel-shaped element may be positioned on the pin end for the handling thereof or during a plasma processing. Said panel-shaped element may present an electrostatic charge. A small diameter for the pins and pin holes is selected such that, in conformity with the panel-shaped element provided with the electrostatic charge, an undesired electrostatic charge on said panel-shaped element is essentially avoided or, in conformity with the panel-shaped element to be plasma processed, a plasma perturbation in the area of the pin holes or pins is essentially avoided.

Abstract: A cover for a roller having at least one roller (2) for transporting a substrate (1) in a deposition system and at least one cover means (6), wherein the roller is retractable away from the substrate and the cover means is adapted for at least partly covering the retracted roller against contamination by a substance present in the deposition system. The cover for a roller has the advantage that the uptime of the deposition system is increased.