Patents Assigned to Ohmega Electronics, Inc.
  • Circuit board material with barrier layer
    Patent number: 5689227
    Abstract: A circuit board material is disclosed which includes a support layer, at least one electrical resistance layer having a preselected resistivity adhered to the support layer, a barrier layer adhered to the electrical resistance layer, and a conductive layer adhered to the barrier layer. The barrier layer is capable of protecting the resistance layer from attack by alkaline ammoniacal copper etchants. A method of producing the circuit board material is also disclosed.
    Type: Grant
    Filed: January 17, 1996
    Date of Patent: November 18, 1997
    Assignee: Ohmega Electronics, Inc.
    Inventors: Phong Xuan Nguyen, Steven Russell Nissen
  • Method for producing a circuit board material employing an improved electroplating bath
    Patent number: 5336391
    Abstract: An improved circuit board material having a support layer, an electrical resistance layer and a conductive layer. The circuit board material has a resistance of at least about 500 ohms/square. The circuit board material is formed by electro-plating the electrical resistance layer on the conductive layer. The conductive layer is desirably activated prior to electro-deposition of the electrical resistance layer thereon. The conductive layer is activated by contacting with an activating agent such as benzotriazole electrolytic chromate and the like. A preferred electro-plating bath for electro-deposition of the electrical resistance layer comprises about 0.5 mole per liters nickel hypophosphite. The disclosed electro-plating bath functions at ambient temperatures and is effectively temperature independent. Circuit boards can be formed from the circuit board material through a process involving only two etching steps.
    Type: Grant
    Filed: September 21, 1992
    Date of Patent: August 9, 1994
    Assignee: Ohmega Electronics, Inc.
    Inventor: James M. Rice
  • Circuit board material and electroplating bath for the production thereof
    Patent number: 4892776
    Abstract: An improved circuit board material having a support layer, an electrical resistance layer and a conductive layer. The circuit board material has a resistance of at least about 500 ohms/square. The circuit board material is formed by electro-plating the electrical resistance layer on the conductive layer. The conductive layer is desirably activated prior to electro-deposition of the electrical resistance layer thereon. The conductive layer is activated by contacting with an activating agent such as benzotriazole electrolytic chromate and the like. A preferred electro-plating bath for electro-deposition of the electrical resistance layer comprises about 0.5 mole per liters nickel hypophosphite. The disclosed electro-plating bath functions at ambient temperatures and is effectively temperature independent. Circuit boards can be formed from the circuit board material through a process involving only two etching steps.
    Type: Grant
    Filed: September 2, 1987
    Date of Patent: January 9, 1990
    Assignee: Ohmega Electronics, Inc.
    Inventor: James H. Rice