Patents Assigned to Ohmega Technologies Inc.
  • Multilayered construction for resistor and capacitor formation
    Patent number: 7192654
    Abstract: The invention concerns multilayered constructions useful for forming resistors and capacitors, for the manufacture of printed circuit boards or other microelectronic devices. The multilayered constructions comprise sequentially attached layers comprising: a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer, and a nickel-phosphorus electrical resistance material layer electroplated onto a second electrically conductive layer.
    Type: Grant
    Filed: February 22, 2005
    Date of Patent: March 20, 2007
    Assignees: Oak-Mitsui Inc., Ohmega Technologies Inc.
    Inventors: John A. Andresakis, Pranabes K. Pramanik, Bruce Mahler, Daniel Brandler