Abstract: A method for high and low temperature laser trimming of resistors is provided. The method includes a ceramic heating plate for heating resistors to a designated temperature before trimming the resistors.

Abstract: A chip resistor whose resistive element provides a power density of at least 20 watts per square inch is provided with an air gap between the resistance element and the electrical contact junctions of the conductive strips electrically connected to the resistance element and terminals attached to the chip resistor. The air gap has a length approximately 70% of the distance between opposing edges of the planar body forming the chip to so restrict heat flow as to prevent the electrical contact junctions from exceeding a temperature of about 175.degree. C. when the resistive element is at a temperature of 350.degree. C. or more.