Patents Assigned to Ohmplus Technology Inc.
  • Patent number: 12287365
    Abstract: The present invention discloses an RF element group testing system and method. The method comprises steps: adding an identification feature to a first RF signal, which is output by one of the plurality of tested RF elements, to generate an identification RF signal; synthesizing the identification RF signal and a second RF signal, which is output by each of the rest of the tested RF elements, to generate a corresponding synthesis signal; resolving the synthesis signal into the identification RF signal and the corresponding second RF signal according to the identification feature; restoring the identification RF signal into the first RF signal; and calculating at least one signal-feature parameter of the first RF signal and the second RF signal.
    Type: Grant
    Filed: June 20, 2023
    Date of Patent: April 29, 2025
    Assignee: Ohmplus Technology Inc.
    Inventors: Chih-Yuan Chu, Hsi-Tseng Chou, Jake Waldvogel Liu, Chih-Wei Chiu
  • Patent number: 12196795
    Abstract: A calibration and group testing system for RF units and a method therefor are provided. The system includes a control device, a signal source device, a test platform, and a measurement device. M times of measurements are performed between the test platform and the measurement device. For each measurement, a microwave signal source is converted into random microwave signals with N random amplitudes and phases, and the RF units are respectively stimulated to output the random microwave signals superimposed on a measured path to form a measurement signal. The measurement device receives measurement signals of the M times of measurements and converts them into M pieces of measurement information, respectively. The control device solves the measurement information and performs iterative and convergent calculations on all solution results to obtain calibration information of the RF units in a specific state, thereby correcting the RF units according to the calibration information.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: January 14, 2025
    Assignee: Ohmplus Technology Inc.
    Inventors: Hsi-Tseng Chou, Jake Waldvogel Liu
  • Patent number: 12025657
    Abstract: The invention describes a system for testing antenna-in-package (AiP) modules and a method for using the same. Firstly, AiP modules respectively receive RF signals from a testing transmitting antenna. Then, at least one of the power and the phase of each of the RF signals is adjusted to generate modulated RF amplified signals as recognition tags with difference. The RF amplified signals are received from each control integrated circuit (IC) and the power of the modulated RF amplified signals is summed to generate a net mixed test signal. Finally, the test signal is received and RF properties corresponding to at least one of the power and the phase of each of the RF amplified signals as recognition tags are obtained. The method can simultaneously test a plurality of AiP modules to shorten the test time.
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: July 2, 2024
    Assignee: Ohmplus Technology Inc.
    Inventors: Hsi-Tseng Chou, Chih-Wei Chiu, Zhao-He Lin, Jake Waldvogel Liu
  • Patent number: 12007430
    Abstract: A device for testing a group of radio-frequency (RF) chip modules and a method for using the same is disclosed. The device includes a signal analyzer, a power divider, control ICs, a signal controller, and a power combiner. The power divider receives an RF signal and transmits RF input signals to the RF chip modules and the control ICs in response to the RF signal. The signal controller controls each control IC to adjust at least one of the power and the phase of the corresponding RF input signal, thereby generating an RF output signal. The power combiner receives the RF output signal from each control IC to generate a test signal. The signal analyzer receives the test signal and obtains RF properties corresponding to at least one of the power and the phase of each RF output signal.
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: June 11, 2024
    Assignee: Ohmplus Technology Inc.
    Inventors: Hsi-Tseng Chou, Chih-Wei Chiu, Zhao-He Lin, Jake Waldvogel Liu