Abstract: A process for providing a margin in a metallized resin film for a condenser element which is characterized by providing on a dielectric resinous layer a water-soluble coating layer having a pattern corresponding to a margin pattern, providing a metal deposition layer on the resinous layer including a coated part and a non-coated part and removing the water-soluble coating layer and the metal deposition layer thereon by washing with water. According to the process, a metallized resin film having an arbitrary margin pattern and a superior electrical property can be readily obtained, with completely eliminating any complexity of the procedure and disadvantage in conventional processes for providing a margin.